Senior Staff Engineer / Principle Engineer (SON Package)

PT Infineon Technologies Batam; Batam; On-site; IDR 600,000,000 - 900,000,000; Full time

Job summary

PT Infineon Technologies Batam invites a Senior/Principal Engineer to lead Molding, Mark, Trim & Form, Die Attach, Clip Attach and Final Test across SON packages in our manufacturing and operations team in Batam. The role emphasizes process optimization, equipment qualification, and cross-functional collaboration in a high-tech cleanroom environment.

The ideal candidate will have 10+ years in semiconductor manufacturing, deep knowledge of molding and die attach equipment, and strong leadership

Qualifications

• Bachelor's/Master/PhD in Engineering or related discipline.
• Minimum ten years semiconductors manufacturing experience with exposure to molding, marking, die attach, clip attach and final test processes.

Responsibilities

• Lead engineering activities for Molding, Mark, Trim & Form, Die Attach, Clip Attach and Final Test for SON product.
• Drive process optimization to improve test yield, quality, productivity, equipment utilization and manufacturing cost.
• Lead process and equipment qualification and process characterization.

Skills

Molding

Mark, Trim & Form

Die Attach

Clip Attach

Final Test, Scan & Pack

Process optimization

Troubleshooting

Leadership

Education

Bachelor's/Master/PhD in Engineering

Tools

ASM AD series Die Bonder

TDSON

STOLL

ExisTech Handler

Job description

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff / Principle Engineer Molding / Mark, Trim & Form / Die Attach / Clip Attach / Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting‑edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time.

Are you in?

Your role

Key responsibilities in your new role

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff / Principle Engineer Molding / Mark, Trim & Form / Die Attach / Clip Attach / Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting‑edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time.

Are you in?

Your role

Key responsibilities in your new role

• Lead engineering activities for Molding / Mark, Trim & Form / Die Attach and Clip Attach / Final Test, Scan and Packing processes for SON product
• Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost
• Lead process & equipment qualification and process characterization.

Your profile

Qualifications and skills to help you succeed

· Bachelor's Degree, Master’s degree or PhD in Engineering (Electrical, Electronics,Mechanical, Materials, Manufacturing, Physics, Computer or relateddiscipline)

· Minimum10years of semiconductormanufacturing experience, with significant exposure to:

o Mold : Transfer Molding processes, BESI,ASM and Asahi equipment.

o Mark, Trim & Form : Marking Processes,Trim & Form operations, BESI and ASM equipment, TDSONor similar leadframe-based packages.

o Die Attach / Clip Attach : Die Attach processor similar leadframe packages, Clip Attach Technology, Solder Pasteand reflow processes, ASM Die Bonder platforms, Knowledge ofleadframe-based power package assembly processes.

o Final Test, Scan and Pack : Final Test operations,ETS88 Test Systems, SRM (Scan and Reel Module) processes, ExisTechHandler platforms.

· Preferred Qualifications

o Die Attach / Clip Attach

-Expertise in ASM AD series Die Bonders orequivalent platforms

-Experience with solder paste, clip attach, andpower package assembly technologies

-Familiarity with TDSON, STOLL or similarleadframe-based packages.

o Final Test, Scan and Pack

-Experience with ETS88 test platformdevelopment, optimization, and troubleshooting

-Strong knowledge of handler-test cellintegration and automation systems.

· Strong troubleshootingand problem-solving skills

· Excellent communication,leadership, and project management capabilities

· Ability towork effectively in a cross-functional and multinationalenvironment.

#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Now in Batam, we are looking for :

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions addressing three central challenges to modern society including energy efficiency, mobility and security. In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo.

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions addressing three central challenges to modern society including energy efficiency, mobility and security. In fiscal year 2006 (ending September), the company achieved sales of Euro 7.9 billion (including Qimonda sales of Euro 3.8 billion) with approximately 42,000 employees worldwide (including approximately 12,000 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the US from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo.

In pursuing the vision of developing semiconductor solutions that change the world, Infineon believes that people are the key. Our people bring technology to life.

Researching careers? Find all the information and tips you need on career advice.