Senior Staff Engineer / Principle Engineer (SON Package)

Infineon Technologies; Batam; On-site; IDR 400,000,000 - 800,000,000; Full time

Job summary

Infineon Technologies in Batam is seeking a Senior Staff/Principal Engineer for molding, mark trim form, die attach, clip attach, and final test, scan and pack in SON packaging. You will lead high-impact engineering activities in a advanced cleanroom environment to improve yield, quality, productivity and cost effectiveness.

The role requires 10+ years in semiconductor manufacturing with hands-on experience in transfer molding, leadframe-based packages, and high-end test platforms.

Qualifications

• Bachelor's, Master's or PhD in Engineering or related field.
• Minimum 10 years in semiconductor manufacturing with specialized exposure.
• Experience with molding, mark trim form, die attach and final test processes.

Responsibilities

• Lead engineering activities for molding, mark trim form, die attach and final test processes.
• Drive process optimization to improve test yield, quality and productivity.
• Lead process and equipment qualification and characterization.

Skills

Molding

Mark Trim Form

Die Attach

Final Test

Automation

Education

Bachelor's / Master’s / PhD in Engineering

Tools

BESI / ASM equipment

TDSON / leadframe

ETS88 Test System

ExisTech Handler

Die Bonder platforms

Job description

#WeAreIn for jobs that impact everyone's life.

Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence.

As a Senior Staff / Principle Engineer Molding / Mark, Trim & Form / Die Attach / Clip Attach / Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time.

Your role

Key responsibilities in your new role

• Lead engineering activities for Molding / Mark, Trim & Form / Die Attach and Clip Attach / Final Test, Scan and Packing processes for SON product
• Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost
• Lead process & equipment qualification and process characterization.

Your profile

Qualifications And Skills To Help You Succeed

• Bachelor's Degree, Master’s degree or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline)
• Minimum10 years of semiconductor manufacturing experience, with significant exposure to:
• Mold : Transfer Molding processes, BESI, ASM and Asahi equipment.
• Mark, Trim & Form : Marking Processes, Trim & Form operations, BESI and ASM equipment, TDSON or similar leadframe-based packages.
• Die Attach / Clip Attach : Die Attach process or similar leadframe packages, Clip Attach Technology, Solder Paste and reflow processes, ASM Die Bonder platforms, Knowledge of leadframe-based power package assembly processes.
• Final Test, Scan and Pack : Final Test operations, ETS88 Test Systems, SRM (Scan and Reel Module) processes, ExisTech Handler platforms.
• Preferred Qualifications
• Die Attach / Clip Attach
• Expertise in ASM AD series Die Bonders or equivalent platforms
• Experience with solder paste, clip attach, and power package assembly technologies
• Familiarity with TDSON, STOLL or similar leadframe-based packages.
• Final Test, Scan and Pack
• Experience with ETS88 test platform development, optimization, and troubleshooting
• Strong knowledge of handler-test cell integration and automation systems.
• Strong troubleshooting and problem-solving skills
• Excellent communication, leadership, and project management capabilities
• Ability to work effectively in a cross-functional and multinational environment.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.