Senior Staff Engineer Technology Integration

Infineon Technologies AG; Batam; On-site; IDR 350,000,000 - 500,000,000; Full time

Job summary

Infineon Technologies AG in Batam, Indonesia is seeking a Lead Engineer to direct technical decision-making for the driver portfolio and analyze stress results. The ideal candidate holds an advanced engineering degree and has over 5 years of experience in semiconductor processes.

Responsibilities include leading teams, evaluating failure modes, and defining problem statements. Infineon values diversity and offers an inclusive working environment characterized by trust, respect, and opportunity for all.

Qualifications

• Holds a Bachelor’s, Master’s, or Doctoral degree in Electrical & Electronics Engineering, Mechanical Engineering, Mechatronics, or Manufacturing Engineering.
• Possesses over 5 years of hands-on experience within leaded package assembly processes in the semiconductor backend.
• Demonstrates a track record of technical leadership with a minimum of 3 years in a lead capacity.
• Exhibits robust technical fundamentals and advanced problem-solving abilities.

Responsibilities

• Lead technical decision-making for Infineon’s driver portfolio.
• Analyze stress results to evaluate failure modes, models, and reliability levels.
• Form and lead multidisciplinary teams to solve complex technical issues.
• Define clear problem statements and structure effective solving frameworks.

Skills

Technical leadership in semiconductor processes

Advanced problem-solving

Galvanic isolation and electrical insulation

Simulation methodologies

Material science

Education

Bachelor’s, Master’s, or Doctoral degree in relevant engineering fields

Job description

Lead technical decision-making for Infineon’s driver portfolio.

Your Role

• Lead technical decision-making for Infineon’s driver portfolio.
• Analyze stress results to evaluate failure modes, models, and reliability levels.
• Form and lead multidisciplinary teams to solve complex technical issues.
• Define clear problem statements and structure effective solving frameworks.
• Partner with Process Development to characterize individual processes and process interaction's
• Translate project development requirements into defined process inputs and outputs.

Your Profile

• Holds a Bachelor’s, Master’s, or Doctoral degree in Electrical & Electronics Engineering, Mechanical Engineering, Mechatronics, or Manufacturing Engineering.
• Possesses over 5 years of hands-on experience within leaded package assembly processes in the semiconductor backend.
• Demonstrates a track record of technical leadership with a minimum of 3 years in a lead capacity.
• Exhibits robust technical fundamentals and advanced problem-solving abilities, particularly in analyzing the complex interactions between technology, materials, design, and manufacturing processes.
• Specialized knowledge in galvanic isolation, material science, and electrical insulation.
• Proven experience in simulation methodologies and package design optimization.

We embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.