Senior Staff Engineer, Encapsulation: Advancing Molding

PT Infineon Technologies Batam; Batam; Presencial; IDR 400.000.000 - 700.000.000; Jornada completa

Descripción de la vacante

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Encapsulation to lead molding process development in a high-tech cleanroom. You will own process design, drive pre-development and development, and ensure robust, efficient molding steps aligned with project timelines and costs.

The role requires strong expertise in molding, IC packaging concepts, and advanced statistical tools, with a track record of resolving complex manufacturing challenges.

Formación

• Master/ bachelor’s degree in engineering and physical science.
• Minimum 5 years in Mold Process Development.
• Experience in IC Packaging concept and process/equipment engineering preferred.
• Proficient with statistical tools and problem-solving methods.
• DoE planning and execution skills required.
• Knowledge in analytical/metrological tools and molding assembly.

Responsabilidades

• Process owner and expert driving molding process development.
• Ensure timely development of robust molding processes meeting timelines, yield and cost targets.
• Develop unit processes compliant with the Process Development Handbook.
• Advocate Design for Manufacturing and Design for Cost.
• Solve complex problems using robust problem-solving tools.
• Lead process/equipment/material strategy alignment with the roadmap.
• Support end-to-end project activities for smooth ramp-up.

Conocimientos

Mold Process Dev

IC Packaging

Process Engineering

Statistical Tools

Design of Experiments

DMAIC & 8D

Molding Assembly

Educación

Master's degree in engineering

Bachelor's degree in physical science

Herramientas

JMP

CEDA

Smart Scope

Hisomet

Descripción del empleo

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Encapsulation to lead molding process development in a high-tech cleanroom. You will own process design, drive pre-development and development, and ensure robust, efficient molding steps aligned with project timelines and costs.

The role requires strong expertise in molding, IC packaging concepts, and advanced statistical tools, with a track record of resolving complex manufacturing challenges.