Senior Mold Process Engineer — Innovation & Ramp-Up

Infineon Technologies AG

Batam

Presencial

IDR 350 000 000 - 550 000 000

Tempo integral

Há 4 dias
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Resumo da oferta

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Encapsulation to advance molding processes from pre-development to production in a high-tech cleanroom environment.

The role emphasizes driving process innovation, meeting yields and cost targets, and applying DoE and problem-solving methodologies. IC packaging concept experience is advantageous for cross-functional collaboration.

Qualificações

  • Master's or Bachelor's degree in engineering and physical science.
  • Minimum 5 years of working experience in Mold Process Development.
  • Experience in IC Packaging Concept and Process/Equipment Engineering is a plus.
  • Proficient with statistical tools such as JMP and CEDA.
  • Analytical and problem-solving skills (P/DFMEA, DMAIC, 8D).
  • Skilled in planning and executing DoE.
  • Knowledge of analytical (SAT) and metrological tools (Smart Scope, Hisomet).
  • Hands-on molding process assembly knowledge.

Responsabilidades

  • Process owner driving molding process innovation, pre-development and development.
  • Ensure timely development of robust molding processes per timeline, yield and cost targets.
  • Develop unit processes per the Process Development Handbook.
  • Advocate Design for Manufacturing and Design for Cost.
  • Independently solve complex problems using structured problem-solving tools.
  • Guide process, equipment and material strategies aligned with the roadmap.
  • Support end-to-end project activities for smooth ramp-up.

Conhecimentos

Mold process development
Statistical tools
P/DFMEA
DMAIC
8D methodology
Design of Experiments (DoE)
Molding assembly
Analytical thinking

Formação académica

Master's or Bachelor's in engineering/physical science

Ferramentas

JMP
CEDA
Smart Scope
Hisomet

Descrição da oferta de emprego

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Encapsulation to advance molding processes from pre-development to production in a high-tech cleanroom environment.

The role emphasizes driving process innovation, meeting yields and cost targets, and applying DoE and problem-solving methodologies. IC packaging concept experience is advantageous for cross-functional collaboration.

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