Staff Etch Process Engineer - ICP & Deep Silicon

Hudson Singapore; Hong Kong; On-site; HKD 556,000 - 865,000; Full time

Job summary

Our Client, a renowned semiconductor equipment company, seeks a Staff Etch Process Engineer to join its Singapore operations, reporting to the Head of Department. You will develop and optimize dry etch processes for device fabrication and collaborate with R&D, Equipment Engineering and Process Integration to improve manufacturability.

Requirements: Bachelor's degree in Engineering, Materials Science, Physics or related field; at least 5 years in semiconductor process engineering; 2–3 years

Qualifications

• Degree in Engineering, Materials Science, Physics or related field.
• 5+ years in semiconductor process engineering in wafer fab or equipment company.
• 2-3+ years hands-on with plasma etch processes and equipment.
• Experience with ICP etch systems; Bosch/TSV advantageous.

Responsibilities

• Develop, characterize, and optimize dry etch processes for devices.
• Collaborate with R&D, Equipment Engineering, and Process Integration to improve manufacturability.
• Plan experiments, evaluate data, and establish robust recipes.
• Investigate deviations and drive yield, quality, and productivity improvements.

Education

Bachelor's degree in Engineering, Materials Science, Physics, or a related field

Tools

ICP etch systems

Bosch process

CCP systems

Job description

Our Client, a renowned semiconductor equipment company, seeks a Staff Etch Process Engineer to join its Singapore operations, reporting to the Head of Department. You will develop and optimize dry etch processes for device fabrication and collaborate with R&D, Equipment Engineering and Process Integration to improve manufacturability.

Requirements: Bachelor's degree in Engineering, Materials Science, Physics or related field; at least 5 years in semiconductor process engineering; 2–3 years