Process Engineer - Poly Etch

STMicroelectronics Asia Pacific Pte Ltd; Hong Kong; On-site; HKD 420,000 - 540,000; Full time

Job summary

STMicroelectronics Asia Pacific Pte Ltd is seeking a Process Engineer to own trench etch processes within the poly team and provide engineering support to the production line for targeted manufacturing performance.

You will optimize inline investigations, set up process recipes for new processes, and collaborate with Maintenance, Supervisors, and Shift Engineers to achieve high yield and low cost while reducing Wafer at Risk.

Qualifications

• Bachelor's degree in a related discipline (Electrical/Electronics, Mechanical, Materials, Chemical)
• Around 2 years of experience with etch processes
• Experience in profile control and process stability
• Ability to conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures and determine appropriate solutions with stakeholders
• Ensure inline investigations are reported in real time with complete details
• Ability to set up process recipes for newly introduced processes
• Establish a robust process control system to minimize WAR and maximize signal-to-noise ratio for SPC and FDC

Responsibilities

• Manage a cost-effective wafer fabrication process by providing engineering support to the production line to achieve targeted performance
• Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely solutions
• Ensure smooth process flow with high quality, high yield, and low cost by collaborating with Maintenance Specialists, Supervisors, and Shift Engineers
• Provide cross-functional, cross-department, and cross-fab support based on operational needs
• Train new engineers and share technical knowledge to support team development
• Support shift operations and transition to normal shift for process/project work
• Take responsibility for trench etch processes within the poly team

Skills

Etch processes

SPC OOC/OOS

FDC failures

Wafer process control

Education

Bachelor's degree in Electrical/Electronics Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Materials Engineering

Bachelor's degree in Chemical Engineering

Job description

YOUR ROLE

• Manage a cost-effective wafer fabrication process by providing engineering support to the production line to achieve the organization’s targeted manufacturing performance. Take full ownership of all engineering issues for the assigned process.
• Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely implementation of effective solutions.
• Ensure smooth process flow withhigh quality, high yield, and low costby working closely with Maintenance Specialists, Production Supervisors, and Shift Engineers to achieve committed targets.
• Provide cross-functional, cross-department, and cross-fab support based on operational needs and priorities.
• Train new engineers and share technical knowledge to support team development.
• Support shift operations as needed and return to normal shift assignment for process/project work when assigned.
• Take responsibility fortrench etch processes within the poly team.

YOUR SKILLS & EXPERIENCES

• Bachelor’s degree inElectrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or a related discipline.
• Around 2 years of experience with etch processes
• Experience in profile control and process stability.
• Ability to conduct real-time problem analysis forSPC OOC/OOS, defect failures, andFDC failures, and determine appropriate solutions by working with all relevant stakeholders.
• Ensure all basic inline investigations are reported in real time to the relevant owners with complete and accurate details.
• Ability to set up process recipes for newly introduced processes.
• Ability to establish a robust process control system to maintain thelowest possible Wafer at Risk (WAR)level, maximize thesignal-to-noise ratiofor SPC and FDC, and minimize human dependency.