Staff Etch Process Engineer

Hudson Singapore; Hong Kong; On-site; HKD 556,000 - 865,000; Full time

Job summary

Our Client, a renowned semiconductor equipment company, seeks a Staff Etch Process Engineer to join its Singapore operations, reporting to the Head of Department. You will develop and optimize dry etch processes for device fabrication and collaborate with R&D, Equipment Engineering and Process Integration to improve manufacturability.

Requirements: Bachelor's degree in Engineering, Materials Science, Physics or related field; at least 5 years in semiconductor process engineering; 2–3 years

Qualifications

• Degree in Engineering, Materials Science, Physics or related field.
• 5+ years in semiconductor process engineering in wafer fab or equipment company.
• 2-3+ years hands-on with plasma etch processes and equipment.
• Experience with ICP etch systems; Bosch/TSV advantageous.

Responsibilities

• Develop, characterize, and optimize dry etch processes for devices.
• Collaborate with R&D, Equipment Engineering, and Process Integration to improve manufacturability.
• Plan experiments, evaluate data, and establish robust recipes.
• Investigate deviations and drive yield, quality, and productivity improvements.

Education

Bachelor's degree in Engineering, Materials Science, Physics, or a related field

Tools

ICP etch systems

Bosch process

CCP systems

Job description

THE COMPANY

Our Client is a renowned organization in the Semiconductor Equipment industry with a strong presence worldwide. They are looking for a Staff Etch Process Engineer as part of their expansion plans in Singapore, reporting to the Head of Department.

THE ROLE

The Staff Etch Process Engineer is responsible for:

• Develop, characterize, and optimize dry etch processes for semiconductor device fabrication.
• Partner with cross-functional teams including R&D, Equipment Engineering, and Process Integration to improve manufacturability and product performance.
• Plan and execute experiments, evaluate process data, and establish robust process recipes.
• Investigate process deviations, resolve technical challenges, and drive yield, quality, and productivity improvements.

Requirements:

• Bachelor's degree in Engineering, Materials Science, Physics, or a related field.
• At least 5 years of experience in semiconductor process engineering in a wafer fab or equipment company.
• Minimum 2-3 years of hands-on experience with plasma etch processes and equipment.
• Experience working with Inductively Coupled Plasma (ICP) etch systems.
• Experience in deep silicon etch, Bosch process, TSV, plasma dicing, deep trench applications, or Capacitively Coupled Plasma (CCP) systems will be an added advantage.

We thank you for your interest in this position. Due to the anticipated overwhelming responses, we regret that only successfully shortlisted applicants will be contacted.