Silicon Photonics Engineer – Semiconductor (Paris Ris)

TempServ Pte Ltd; Hong Kong; On-site; HKD 480,000 - 720,000; Full time

Job summary

Tempserv Pte Ltd in Hong Kong is seeking an experienced Silicon Photonics engineer to develop and optimize 300mm SiPh platforms, including pluggable modules and co-packaged optics.

You will collaborate with internal R&D and module engineering to define process flows, engage customers on requirements, coordinate with OSATs, and apply DOE, FMEA, and control plans to drive reliability and performance.

Qualifications

• Bachelor’s degree in Electronics or related field.
• 3+ years hands-on Silicon Photonics R&D or related semiconductor development.
• Experience in SiPh process development or packaging preferred.
• Familiar with semiconductor foundry environments and module development.
• Knowledge of DOE, FMEA, and data-driven problem solving.
• Strong communication and collaboration skills.

Responsibilities

• Develop and optimize 300mm SiPh platforms, including pluggable modules and CPO.
• Collaborate with R&D and module engineering to define SiPh flows.
• Engage with customers to align device and process requirements.
• Coordinate with OSATs and partners for packaging integration.
• Apply DOE, FMEA and control plan methodologies to support development.
• Analyze data and implement improvements to performance and reliability.

Skills

SiPh R&D

Process integration

Data-driven problem solving

Cross-functional collaboration

Customer engagement

Education

Bachelor's degree in Electronics/EE/Physics

Tools

DOE

FMEA

Control planning

Job description

Key Responsibilities

• Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions.
• Collaborate with internal R&D and module engineering teams to define, develop, and execute SiPh process flows.
• Engage with customers through technical discussions to align device and process requirements.
• Coordinate with external OSATs and technology partners for PIC/EIC characterization and packaging integration.
• Apply DOE, FMEA, and control plan methodologies to support technology development, risk management, and process optimization.
• Analyze development data and implement improvement initiatives to enhance process performance and reliability.

Qualifications

• Bachelor’s degree in Electronics Engineering, Electrical Engineering, Physics, Materials Engineering, or a related discipline.
• Minimum 3 years of hands‑on experience in Silicon Photonics (SiPh) R&D, process integration, or related semiconductor technology development.
• Experience in SiPh process development, photonic IC packaging, optical device design, or characterization is preferred.
• Familiarity with semiconductor foundry environments, including process integration or module‑level development responsibilities.
• Knowledge of DOE, FMEA, control planning, and data‑driven problem‑solving methodologies.
• Strong communication and collaboration skills with the ability to work effectively with internal teams and external partners.

Tempserv Pte Ltd