Silicon Photonics Process Engineer - IC Packaging & CPO

TempServ Pte Ltd; Hong Kong; On-site; HKD 480,000 - 720,000; Full time

Job summary

Tempserv Pte Ltd in Hong Kong is seeking an experienced Silicon Photonics engineer to develop and optimize 300mm SiPh platforms, including pluggable modules and co-packaged optics.

You will collaborate with internal R&D and module engineering to define process flows, engage customers on requirements, coordinate with OSATs, and apply DOE, FMEA, and control plans to drive reliability and performance.

Qualifications

• Bachelor’s degree in Electronics or related field.
• 3+ years hands-on Silicon Photonics R&D or related semiconductor development.
• Experience in SiPh process development or packaging preferred.
• Familiar with semiconductor foundry environments and module development.
• Knowledge of DOE, FMEA, and data-driven problem solving.
• Strong communication and collaboration skills.

Responsibilities

• Develop and optimize 300mm SiPh platforms, including pluggable modules and CPO.
• Collaborate with R&D and module engineering to define SiPh flows.
• Engage with customers to align device and process requirements.
• Coordinate with OSATs and partners for packaging integration.
• Apply DOE, FMEA and control plan methodologies to support development.
• Analyze data and implement improvements to performance and reliability.

Skills

SiPh R&D

Process integration

Data-driven problem solving

Cross-functional collaboration

Customer engagement

Education

Bachelor's degree in Electronics/EE/Physics

Tools

DOE

FMEA

Control planning

Job description

Tempserv Pte Ltd in Hong Kong is seeking an experienced Silicon Photonics engineer to develop and optimize 300mm SiPh platforms, including pluggable modules and co-packaged optics.

You will collaborate with internal R&D and module engineering to define process flows, engage customers on requirements, coordinate with OSATs, and apply DOE, FMEA, and control plans to drive reliability and performance.