Engineer, R&D Process Development (Underfill)

United Test And Assembly Center Limited (UTAC); Hong Kong; On-site; HKD 420,000 - 540,000; Full time

Job summary

United Test And Assembly Center Limited (UTAC) in Hong Kong is seeking an Underfill Process Development Engineer to develop, optimize, qualify and sustain underfill processes for advanced semiconductor packaging technologies including Flip Chip, 2.5D and SiP.

You will work with customers, material suppliers and manufacturing teams to deliver robust underfill solutions that meet quality, reliability and productivity targets, applying DOE, process characterization and yield improvement methods.

Qualifications

• Bachelor's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electronics Engineering, Semiconductor Engineering or related Engineering discipline.
• At least 3 years of semiconductor packaging process development experience.
• Experience in underfill process development preferred.
• Experience in advanced packaging technologies is highly desirable.

Responsibilities

• Develop and optimize capillary underfill and advanced dispensing processes for semiconductor packages.
• Establish process windows for underfill dispense, flow, cure, and post-cure operations.
• Evaluate new underfill materials and dispensing technologies.
• Define and execute Design of Experiments (DOE) to improve process capability and performance.
• Develop processes for advanced packaging applications including Flip Chip, 2.5D, and SiP technologies.

Skills

Capillary underfill

Underfill dispensing

DOE

Statistical analysis

Process characterization

Root cause analysis

Yield improvement

Semiconductor packaging fundamentals

Education

Bachelor's Degree in Chemical Engineering or related

Tools

Asymtek dispensing equipment

NSW/leading dispensers

Job description

The Underfill Process Development Engineer is responsible for developing, optimizing, qualifying, and sustaining underfill processes for advanced semiconductor packaging technologies. This role focuses on process characterization, material evaluation, reliability improvement, yield enhancement, and equipment optimization for flip chip, SiP and advanced package assemblies.

The engineer will work closely with customers, material suppliers, equipment vendors, manufacturing teams, and reliability engineers to develop robust and cost-effective underfill solutions that meet quality, reliability, and productivity requirements.

Key Responsibilities

• Develop and optimize capillary underfill and advanced dispensing processes for semiconductor packages.
• Establish process windows for underfill dispense, flow, cure, and post-cure operations.
• Evaluate new underfill materials and dispensing technologies.
• Define and execute Design of Experiments (DOE) to improve process capability and performance.
• Develop processes for advanced packaging applications including Flip Chip, 2.5D, and SiP technologies.

Requirements

• Bachelor's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electronics Engineering, Semiconductor Engineering or related Engineering discipline.
• At least 3 years of semiconductor packaging process development experience.
• Experience in underfill process development preferred.
• Experience in advanced packaging technologies is highly desirable.

Technical Skills Requirements

• Hands-on experience with underfill dispensing and curing processes. Familiarity with Asymtek, NSW and leading dispensers or equivalent equipment will be an advantage.
• DOE and statistical analysis
• Process characterization and optimization
• Root cause analysis methodologies
• Yield improvement techniques
• Semiconductor packaging fundamentals
• SPC, FMEA, Control Plans
• Failure analysis methodologies