Process Engineer, Backfinish (JR13666)

STMicroelectronics Asia Pacific Pte Ltd; Hong Kong; On-site; HKD 320,000 - 520,000; Full time

Job summary

STMicroelectronics Asia Pacific Pte Ltd in Hong Kong seeks a Backfinish Process Engineer to support metallization and backgrind operations in a high-volume semiconductor environment. You will collaborate with Equipment Engineering, Production and Quality to maintain stable process performance and drive continuous improvement.

Responsibilities include monitoring equipment, updating process parameters, analyzing data for yield gains, leading root-cause analyses, supporting process changes and

Qualifications

• Bachelor’s degree in Microelectronics, Electronics, Materials Engineering, Process Engineering, or a related technical discipline.
• 1–3 years of hands-on experience in semiconductor wafer fabrication (basic understanding of metallization or wafer thinning process is a plus).
• Well‑versed in semiconductor process control frameworks, including SPC, FMEA, and APC
• Strong analytic mindset with ability to troubleshoot process issues independently and perform root‑cause analysis
• Good communication skills and ability to collaborate across functions
• Ability to work in a structured, fast‑paced production environment
• Team‑oriented, proactive, and eager to grow technically

Responsibilities

• Support day-to-day monitoring and troubleshooting of metallization and backgrind equipment and processes.
• Assist in defining, updating, and maintaining process parameters, recipes, operating windows, and control plans.
• Analyze process data, identify abnormalities, and propose corrective actions to improve yield, quality, and equipment reliability.
• Participate in root cause analysis for process excursions, equipment stops, defects, and scrap reduction.
• Support debugging, qualification, and implementation of process changes, new equipment, and engineering trials.
• Work with Production and Quality teams to support issue containment, problem solving, and lot disposition.
• Participate in SPC / KPI monitoring, data reviews, and regular reporting on process performance.
• Support continuous improvement initiatives focused on cost, quality, productivity, and safety.

Skills

Metallization

Backgrind

SPC

FMEA

APC

Root cause analysis

Data analysis

Cross-functional collab

Communication

Structured environment

Team orientation

Education

Bachelor’s degree in Microelectronics, Electronics, Materials Engineering, Process Engineering, or a related technical discipline

Job description

As a Backfinish Process Engineer, you will support the manufacturing and optimization of metallization and backgrind processes in a high-volume semiconductor environment. You will work closely with equipment engineering, production, quality teams to ensure stable process performance, high yields, and continuous improvement.

Your responsibilities will include:

• Support day-to-day monitoring and troubleshooting of metallization and backgrind equipment and processes.
• Assist in defining, updating, and maintaining process parameters, recipes, operating windows, and control plans.
• Analyze process data, identify abnormalities, and propose corrective actions to improve yield, quality, and equipment reliability.
• Participate in root cause analysis for process excursions, equipment stops, defects, and scrap reduction.
• Support debugging, qualification, and implementation of process changes, new equipment, and engineering trials.
• Work with Production and Quality teams to support issue containment, problem solving, and lot disposition.
• Participate in SPC / KPI monitoring, data reviews, and regular reporting on process performance.
• Support continuous improvement initiatives focused on cost, quality, productivity, and safety.

YOUR SKILLS & EXPERIENCES

• Bachelor’s degree in Microelectronics, Electronics, Materials Engineering, Process Engineering, or a related technical discipline
• At least 1–3 years of hands‑on experience in the semiconductor wafer fabrication (basic understanding of metallization or wafer thinning process is a plus)
• Well‑versed in semiconductor process control frameworks, including SPC, FMEA, and APC
• Strong analytic mindset with ability to troubleshoot process issues independently and perform root‑cause analysis
• Good communication skills and ability to collaborate across functions
• Ability to work in a structured, fast‑paced production environment
• Team‑oriented, proactive, and eager to grow technically