Underfill Process Engineer — Advanced Packaging

United Test And Assembly Center Limited (UTAC)

Hong Kong

On-site

HKD 420,000 - 540,000

Full time

7 days ago

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Job summary

United Test And Assembly Center Limited (UTAC) in Hong Kong is seeking an Underfill Process Development Engineer to develop, optimize, qualify and sustain underfill processes for advanced semiconductor packaging technologies including Flip Chip, 2.5D and SiP.

You will work with customers, material suppliers and manufacturing teams to deliver robust underfill solutions that meet quality, reliability and productivity targets, applying DOE, process characterization and yield improvement methods.

Qualifications

Bachelor's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electronics Engineering, Semiconductor Engineering or related Engineering discipline.
At least 3 years of semiconductor packaging process development experience.
Experience in underfill process development preferred.
Experience in advanced packaging technologies is highly desirable.

Responsibilities

Develop and optimize capillary underfill and advanced dispensing processes for semiconductor packages.
Establish process windows for underfill dispense, flow, cure, and post-cure operations.
Evaluate new underfill materials and dispensing technologies.
Define and execute Design of Experiments (DOE) to improve process capability and performance.
Develop processes for advanced packaging applications including Flip Chip, 2.5D, and SiP technologies.