R&D Manager

ASMPT; Hong Kong; Vor Ort; HKD 1.000.000 - 1.700.000; Vollzeit

Benefits dieser Stelle

Competitive salary

Fringe benefits

Zusammenfassung

ASMPT is seeking an experienced R&D Manager to lead development of advanced semiconductor packaging solutions, focusing on ultrasonic actuator technology, precision motion systems, and mechatronic products.

You will manage engineering projects and teams, driving innovation and collaborating with global R&D, manufacturing, and product groups to deliver high-performance products from concept to commercialization.

Qualifikationen

• Master's degree or higher in a relevant field.
• Minimum 6 years of experience in R&D, product development, or engineering within semiconductor equipment or related industries.
• Multinational engineering environment experience preferred.

Aufgaben

• Lead the research, design, and development of advanced technologies for semiconductor packaging equipment.
• Plan, manage, and monitor R&D projects ensuring timely delivery and milestones.
• Coordinate resources and priorities across multiple development projects.

Kenntnisse

R&D leadership

Project management

Cross-functional collaboration

Ausbildung

Master's degree or above in Mechanical Engineering, Mechatronics, Automation and Computer-Aided Engineering

Tools

FEA software

Engineering simulations

Jobbeschreibung

We are seeking an experienced R&D Manager to lead the development of advanced semiconductor packaging solutions, with a focus on ultrasonic actuator technology, precision motion systems, and innovative mechatronic products. The successful candidate will manage engineering projects and teams, drive technology innovation, and collaborate closely with global R&D, manufacturing, and product teams to deliver high-performance products from concept to commercialization.

Research & Development

• Lead the research, design, and development of advanced technologies to be applied in semiconductor packaging equipment.

• Develop, optimize, and design mechatronic precision system in Sub micron level

• Familiar with motion control is preferred.

• Conduct engineering simulations, performance analysis, and verification testing to achieve product performance and reliability objectives.

Project Management

• Plan, manage, and monitor R&D projects to ensure timely delivery, budget control, and achievement of technical milestones.

• Coordinate resources and priorities across multiple development projects.

• Prepare project updates, technical reports, and development roadmaps for management review.

Product Industrialization & Manufacturing Support

• Work closely with manufacturing teams to facilitate new product introduction (NPI) and technology transfer.

• Drive yield improvement, process optimization, cost reduction, and quality enhancement initiatives.

• Develop standardized production processes and engineering documentation to support mass production.

Cross-Functional Collaboration

• Collaborate with global R&D teams, suppliers, and external partners on technology development projects.

• Provide technical expertise and problem-solving support for production, quality, operations, and customer-facing teams.

• Partner with product management to translate market requirements into technical solutions.

Innovation & Intellectual Property

• Contribute to the development of proprietary technologies and intellectual property.

• Support patent filing activities and technology innovation initiatives.

• Monitor industry trends and emerging technologies within semiconductor packaging and precision engineering.

Education

• Master's Degree or above in Mechanical Engineering, Mechatronics, Automation and Computer-Aided Engineering, or related disciplines.

Experience

• Minimum 6 years of experience in R&D, product development, or engineering within semiconductor equipment, advanced packaging, precision engineering, or related industries.

• Proven track record in product development projects.

• Preferred experience in a multinational engineering environment.

Technical Competencies

• Semiconductor electronics packaging processes and equipment

• Precision motion control systems

• Piezoelectric actuators and transducers

• Mechatronic system design

• Finite Element Analysis (FEA) and engineering simulation

• Product validation and reliability testing

• Design for Manufacturing (DFM) and Design for Assembly (DFA)

• Root cause analysis and problem solving

• New Product Introduction (NPI)

Attractive salary and fringe benefits package will be offered to the right candidates.

Please visit our company website for our company background, products and other useful information.
Website:https://www.asmpt.com/

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.