APAC Director of Software Engineering — Securities Lending

JPMorgan Chase Bank, N.A.

Hong Kong

Presencial

HKD 900.000 - 1.500.000

Jornada completa

Hace 2 días

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Descripción de la vacante

JPMorgan Chase Bank, N.A. in Hong Kong seeks a Director of Software Engineering for Securities Lending Technology to lead APAC engineering in the Hong Kong hub and drive delivery across the EFP platform.

You will oversee a team of engineers and partner with product and business to translate strategy into scalable solutions. You will champion modern engineering practices, drive AI-assisted tooling adoption, and ensure governance across global stakeholders while balancing regulatory and market

Formación

Proven engineering leadership at Director/ED level in a regulated environment.
Deep technical background in Java-based distributed systems and event-driven architecture.
Experience with cloud-native deployment (AWS) and container orchestration (Kubernetes).
Strong track record delivering complex financial technology projects.
Ability to influence across a globally matrixed organisation.

Responsabilidades

Lead, develop, and retain a team of engineers in APAC Hong Kong.
Own the APAC engineering delivery roadmap balancing business and regulatory priorities.
Act as senior technical stakeholder for APAC trading desk and partners.
Drive engineering excellence: code quality, tests, reliability, and practices.
Represent APAC engineering in cross-domain forums and governance.