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JPMorgan Chase Bank, N.A. in Hong Kong seeks a Director of Software Engineering for Securities Lending Technology to lead APAC engineering in the Hong Kong hub and drive delivery across the EFP platform.
You will oversee a team of engineers and partner with product and business to translate strategy into scalable solutions. You will champion modern engineering practices, drive AI-assisted tooling adoption, and ensure governance across global stakeholders while balancing regulatory and market
The Securities Lending technology organisation within J.P. Morgan's Commercial & Investment Bank builds and operates the Enterprise Finance Platform (EFP) — the firm's strategic, end-to-end system of record for securities lending and equity finance globally. EFP processes billions of dollars of transactions daily across equities, fixed income, and repo products, serving institutional clients and internal trading desks across APAC, EMEA, and NA. The platform spans the full securities lending lifecycle: pre-trade locate and availability, rate management, trading, trade entry and lifecycle management, post-trade settlement, and reconciliation. The APAC engineering hub in Hong Kong is the primary technology presence covering Asian market hours and is a critical node in the firm's global follow-the-sun engineering model.
As a Director of Software Engineering at JPMorganChase within the Securities Lending technology, you lead a technical area and drive impact within teams, technologies, and projects across departments. Utilize your in-depth knowledge of software, applications, technical processes, and product management to drive multiple complex projects and initiatives, while serving as a primary decision maker for your teams and be a driver of innovation and solution delivery.
Job responsibilities
Required qualifications, capabilities, and skills