Quantum Packaging Technician - Build & Test Quantum Devices

Quantum Motion; Greater London; On-site; GBP 55,000 - 75,000; Full time

Benefits offered by this job

Competitive salary

Share options

Contributory pension

Group private medical insurance

Choose your own laptop/kit

Life Assurance

Cycle-to-work Scheme

Flexible working

Central London location

Job summary

Quantum Motion in London is seeking a skilled Quantum Packaging Technician to join our 3D Integration and Advanced Packaging team. You will assemble, package and test quantum processors, turning components into fully packaged, testable devices.

Working at the interface of electronics and cryogenic quantum technology, you will help develop packaging approaches, support automated testing, and contribute to scalable processes as we push silicon-based quantum computing toward practical applications.

Qualifications

• 3+ years of experience in electronics assembly (PCB, soldering, wire bonding or flip-chip).
• 3+ years hands-on experience with bench-top test equipment (SMUs, VNAs, oscilloscopes).
• Hands-on, detail-oriented problem solver with quality focus.
• Ability to work in a multidisciplinary engineering team and learn fast new technologies.

Responsibilities

• Assemble PCBs and final packaging of quantum devices.
• Test packaged devices for processing, integration and yield.
• Develop and implement automated testing at room and cryogenic temperatures.
• Maintain records of maintenance, support activities and assembly requirements.
• Troubleshoot, debug and perform failure analysis of quantum processors and packaged devices.
• Improve packaging processes as the team scales.
• Collaborate with engineers across hardware, process, design, and electronics.

Skills

Electronics assembly

PCB manufacturing

Soldering

Wire bonding

Flip‑chip assembly

Bench-top test gear

Oscilloscopes

VNAs

Problem solving

Tools

EDA software

Schematic capture

PCB layout

Job description

Quantum Motion in London is seeking a skilled Quantum Packaging Technician to join our 3D Integration and Advanced Packaging team. You will assemble, package and test quantum processors, turning components into fully packaged, testable devices.

Working at the interface of electronics and cryogenic quantum technology, you will help develop packaging approaches, support automated testing, and contribute to scalable processes as we push silicon-based quantum computing toward practical applications.