Quantum Package Technician

Quantum Motion; Greater London; On-site; GBP 30,000 - 48,000; Full time

Benefits offered by this job

Competitive salary

Share options scheme

Contributory pension scheme

Group private medical insurance scheme

Choose your own laptop/kit

Life Assurance

Cycle-to-work Scheme

Flexible working

Central London location

Job summary

Quantum Motion in London is seeking a Packaging Technician to join the 3D Integration and Advanced Packaging team. You will assemble, package, and test quantum processors on PCBs and support innovative R&D activities within the team.

We require 3+ years in electronics assembly and experience with test equipment. The role offers a chance to contribute to a world-leading silicon-based quantum platform in a cutting-edge lab environment.

Qualifications

• 3+ years of experience in electronics assembly, including PCB manufacturing, soldering, wire bonding to ICs or flip-chip assemblies.
• Experience with bench-top test equipment such as SMUs, VNAs or oscilloscopes.
• Ability to work collaboratively with colleagues and stakeholders across the company.

Responsibilities

• Assemble PCBs and perform final packaging of quantum devices on PCBs.
• Support development of automated testing at room and cryogenic temperatures.
• Test packaged devices to verify processing, integration, and yield.
• Manage a dedicated section of the packaging pipeline with maintenance and assembly needs.
• Assist in troubleshooting and debugging of quantum processors.

Skills

Electronics assembly

Bench-top test equipment

Teamwork

Tools

SMUs

VNAs

Oscilloscopes

Job description

About The Role and Team

Quantum Motion is a fast-growing quantum computing scale-up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years’ experience in developing qubits and quantum computing architectures. Bringing together state-of-the-art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial-grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.

Our Team

Since 2021 our team has been listed every year in the “Top 100 Startups worth watching”in the EE Timesin 2021 and 2022, and our technology breakthroughs have been featured inThe Telegraph,BBCand theNew Statesman. Our founders are internationally renowned researchers from UCL and Oxford University who have pioneered the development of qubits and quantum computing architectures. Our chairman is the co-founder of Cadence and Synopsys, the two leading companies in the area of Electronic Design Automation. We’re backed by a team of top-tier investors, and we have recently closed ourSeries C funding of $160 million.

We bring together the brightest quantum engineers, integrated circuit (IC) engineers, quantum computing theoreticians and software engineers to create a unique, world-leading team, working together closely to maximise our combined expertise. Our collaborative and interdisciplinary culture is an ideal fit for anyone who thrives in a cutting‑edge research and development environment focused on tackling big challenges and contributing to the development of scalable quantum computers based on silicon technology.

This is a rare and exciting opportunity to be an employee at a scale‑up shaping the future of quantum computing. There are vast opportunities for professional growth and to make an impact within the company.

Our team of 100+ is based across London, Oxford, San Sebastián and Sydney, with our primary hub in Islington (London).

Functions of the Role

We’re looking for a Packaging Technician to join the 3D Integration and Advanced Packaging team. Your role will be to assemble, package, and test quantum processors, as well as support novel R&D activities within the team.

• Assemble PCBs and final packaging of quantum devices on said PCBs.

• Support the development of automated testing at room and cryo temperatures.

• Perform testing on packaged devices to verify processing, integration, and yield.

• Take ownership of a dedicated section of the packaging pipeline, maintaining a clear list of maintenance, support tasks, and assembly requirements.

• Support troubleshooting and debugging of quantum processors

Experience - Essentials

• 3+ years of experience in electronics assembly, such as PCB manufacturing, soldering, wire bonding to integrated circuits, and/or flip-chip assemblies.

• 3+ years of experience with bench-top electronic test equipment, such as SMUs, VNAs, and/or oscilloscopes.

• Ability to work in a team and collaborate with other stakeholders in the company.

Experience - Desirable

• Experience with advanced packaging technology and/or 3D integration.

• Experience with schematic capture and PCB layout EDA software.

• Experience working with cryogenic systems or high-vacuum environments.

Benefits

• Be part of a creative, world-leading team

• Competitive salary and share options scheme

• Contributory pension scheme

• Group private medical insurance scheme

• Choose your own laptop/kit

• Life Assurance

• Cycle-to-work Scheme

• Flexible working

• Central London location

EEO Statement

Quantum Motion is committed to providing equal employment opportunity and does not discriminate based on age, sex, sexual orientation, gender identity, race, colour, religion, disability status, marital status, pregnancy, gender reassignment or any other protected characteristics covered by the Equality Act 2010.

Internal Job Reference Number

QSiP0001