Lead Engineer, 3D Integration & Advanced Packaging

Quantum

City of Westminster

On-site

GBP 140,000 - 190,000

Full time

6 days ago

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Benefits offered by this job

Competitive salary and share options

Contributory pension scheme

Group private medical insurance scheme

Life Assurance

Cycle-to-work Scheme

Central London location

Job summary

Quantum Motion in London is seeking a senior packaging and systems leader to drive R&D of 3D integrated circuits and multi-chip quantum modules, using TSVs and microbumps to perform at millikelvin temperatures. You will recruit and mentor a cross-disciplinary team, oversee external foundries and OSATs, and co-optimize electro-thermal-mechanical designs with cryogenic and quantum hardware groups.

Join a fast-growing scale-up with Islington-based hub, a track record of breakthroughs, and a strong

Qualifications

7+ years deep technical experience in 3D integration with TSVs and microbumps.
Proven track record building and scaling engineering teams in fast-paced environments.
Experience with external semiconductor foundries or advanced packaging facilities.

Responsibilities

Recruit, mentor, and lead a multi-discipline team of engineers.
Drive strategy, design, and rapid prototyping of 3D ICs and multi-chip modules.
Ensure packaging can withstand millikelvin thermal cycling without degradation.
Own external transfers to manufacturing lines and coordinate with OSATs.
Co-optimise electrical, thermal, and mechanical design with cryogenic hardware teams.
Balance rapid prototyping with yield improvement, failure analysis, and reliability.
Collaborate with cryo R&D and quantum physics teams; oversee tech transfers.

Skills

3D integration

TSVs & microbumps

Signal integrity

Cryogenic electronics

External foundry collaboration

Ansys HFSS

Ansys Q3D

Cadence

Quantum mechanics basics

Silicon spin qubits

Materials science

Education

Master's or PhD in electrical engineering, materials science, physics, microelectronics, or related field

Tools

Ansys HFSS

Ansys Q3D

Cadence

Job description

In this role, you will build and lead a team to drive the R&D of complex, multi-chip modules utilising TSVs and microbumps, optimised to operate at millikelvin temperatures. This is a rare and exciting opportunity to solve the industry's toughest interconnect bottlenecks and shape the physical architecture of next-generation quantum processors.

Recruit, mentor, and lead a high-performing team of packaging, signal integrity, materials, and quantum integration engineers.
Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi-chip quantum modules.
Ensure all packaging architectures and interconnects can withstand thermal cycling down to millikelvin regimes without delamination or performance degradation.
Own relevant operations with external foundries, OSATs, and research partners. Seamlessly transfer novel packaging designs to external manufacturing lines.
Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams to co-optimise the electrical, thermal, and mechanical design.
Balance rapid R&D prototyping with a rigorous, parallel focus on yield improvement, failure analysis, and long-term reliability. Master's or PhD in electrical engineering, materials science, physics, microelectronics, or related field.
7+ years deep technical experience in 3D integration, specifically with TSVs, fine-pitch microbumps, flip-chip bonding, and/or multi-chip modules.
Proven track record or building, scaling, and managing engineering teams in high-tech, fast-paced environments.
Strong experience managing technical transfers and working closely with external semiconductor foundries or advanced packaging facilities., Proficiency with industry-standard simulation tools (e.g., Ansys HFSS/Q3D, Cadence) to model signal integrity, thermal stress, and mechanical behaviour.
Direct experience with cryogenic electronics.
Background or strong familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics.
Knowledge of materials behaviour (superconductors, low loss dielectrics) at extreme temperatures. Quantum Motion is a fast-growing quantum computing scale‑up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years' experience in developing qubits and quantum computing architectures. Bringing together state‑of‑the‑art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial‑grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.

Quantum Motion is a fast-growing quantum computing scale‑up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years' experience in developing qubits and quantum computing architectures. Bringing together state‑of‑the‑art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial‑grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.

Our Team Since 2021 our team has been listed every year in the "Top 100 Startups worth watching" in the EE Times in 2021 and 2022, and our technology breakthroughs have been featured in The Telegraph, BBC and the New Statesman. Our founders are internationally renowned researchers from UCL and Oxford University who have pioneered the development of qubits and quantum computing architectures. Our chairman is the co‑founder of Cadence and Synopsys, the two leading companies in the area of Electronic Design Automation. We're backed by a team of top‑tier investors, and we have recently closed our Series C funding of $160 million. We bring together the brightest quantum engineers, integrated circuit (IC) engineers, quantum computing theoreticians and software engineers to create a unique, world‑leading team, working together closely to maximise our combined expertise. Our collaborative and interdisciplinary culture is an ideal fit for anyone who thrives in a cutting‑edge research and development environment focused on tackling big challenges and contributing to the development of scalable quantum computers based on silicon technology. This is a rare and exciting opportunity to be an employee at a scale‑up shaping the future of quantum computing. There are vast opportunities for professional growth and to make an impact within the company. Our team of 100+ is based across London, Oxford, San Sebastián and Sydney, with our primary hub in Islington (London).