Packaging Technician

Quantum Motion; Greater London; On-site; GBP 55,000 - 75,000; Full time

Benefits offered by this job

Competitive salary

Share options

Contributory pension

Group private medical insurance

Choose your own laptop/kit

Life Assurance

Cycle-to-work Scheme

Flexible working

Central London location

Job summary

Quantum Motion in London is seeking a skilled Quantum Packaging Technician to join our 3D Integration and Advanced Packaging team. You will assemble, package and test quantum processors, turning components into fully packaged, testable devices.

Working at the interface of electronics and cryogenic quantum technology, you will help develop packaging approaches, support automated testing, and contribute to scalable processes as we push silicon-based quantum computing toward practical applications.

Qualifications

• 3+ years of experience in electronics assembly (PCB, soldering, wire bonding or flip-chip).
• 3+ years hands-on experience with bench-top test equipment (SMUs, VNAs, oscilloscopes).
• Hands-on, detail-oriented problem solver with quality focus.
• Ability to work in a multidisciplinary engineering team and learn fast new technologies.

Responsibilities

• Assemble PCBs and final packaging of quantum devices.
• Test packaged devices for processing, integration and yield.
• Develop and implement automated testing at room and cryogenic temperatures.
• Maintain records of maintenance, support activities and assembly requirements.
• Troubleshoot, debug and perform failure analysis of quantum processors and packaged devices.
• Improve packaging processes as the team scales.
• Collaborate with engineers across hardware, process, design, and electronics.

Skills

Electronics assembly

PCB manufacturing

Soldering

Wire bonding

Flip‑chip assembly

Bench-top test gear

Oscilloscopes

VNAs

Problem solving

Tools

EDA software

Schematic capture

PCB layout

Job description

About The Role and Team

Quantum Motion is a fast-growing quantum computing scale-up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years’ experience in developing qubits and quantum computing architectures. Bringing together state-of-the-art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial-grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.

As aQuantum Packaging Technician, you’ll play a hands‑on role in turning cutting-edge quantum devices into working, testable systems. You’ll work at the interface of electronics, advanced packaging and quantum technology, helping us develop and scale the processes needed to build the next generation of silicon-based quantum computers.

This is an opportunity to work with technology that is still being invented and to have a direct impact on how it moves from the laboratory towards scalable quantum computing.

Our Team

Since 2021 our team has been listed every year in the "Top 100 Startups worth watching"in the EE Timesin 2021 and 2022, and our technology breakthroughs have been featured inThe Telegraph,BBCand theNew Statesman. Our founders are internationally renowned researchers from UCL and Oxford University who have pioneered the development of qubits and quantum computing architectures. Our chairman is the co-founder of Cadence and Synopsys, the two leading companies in the area of Electronic Design Automation. We’re backed by a team of top-tier investors, and we have recently closed ourSeries C funding of $160 million.

We bring together the brightest quantum engineers, integrated circuit (IC) engineers, quantum computing theoreticians and software engineers to create a unique, world-leading team, working together closely to maximise our combined expertise. Our collaborative and interdisciplinary culture is an ideal fit for anyone who thrives in a cutting-edge research and development environment focused on tackling big challenges and contributing to the development of scalable quantum computers based on silicon technology.

This is a rare and exciting opportunity to be an employee at a scale-up shaping the future of quantum computing. There are vast opportunities for professional growth and to make an impact within the company.

Our team of 100+ is based across London, Oxford, San Sebastián and Sydney, with our primary hub in Islington (London).

Functions of the Role

We’re looking for aQuantum Packaging Technicianto join our3D Integration and Advanced Packaging team. You’ll be a key part of the hands‑on engineering work that takes quantum processors from individual components to fully packaged, testable devices.

You’ll assemble, package and test quantum processors, while also supporting the development of new packaging and integration approaches. You’ll work closely with engineers across the business and have the opportunity to contribute to novel R&D projects as we push the boundaries of what is possible with silicon quantum technology.

• Assemble PCBs and carry out final packaging and integration of quantum devices onto PCBs.




• Perform electrical testing on packaged devices to assess processing, integration and yield.




• Support the development and implementation of automated testing at both room and cryogenic temperatures.




• Execute a dedicated part of the packaging pipeline, maintaining clear records of maintenance, support activities and assembly requirements.




• Support troubleshooting, debugging and failure analysis of quantum processors and packaged devices.




• Contribute to the development and improvement of packaging processes as the team scales.




• Work collaboratively with engineers across quantum hardware, process integration, design, and electronics to solve challenging technical problems.

Experience - Essentials

• 3+ years of experience in electronics assembly, such as PCB manufacturing, soldering, wire bonding to integrated circuits and/or flip‑chip assembly.




• 3+ years of hands‑on experience using bench‑top electronic test equipment, such as SMUs, VNAs and/or oscilloscopes.




• A practical, hands‑on approach to problem solving, with strong attention to detail and a focus on quality.




• Ability to work collaboratively as part of a multidisciplinary engineering team and communicate effectively with stakeholders across the company.A willingness to learn and work with new technologies in a fast‑paced R&D environment.

Experience - Desirable

• Experience with advanced packaging technologies and/or 3D integration.




• Experience with schematic capture and PCB layout EDA software.




• Experience working with cryogenic systems and/or high‑vacuum environments.




• Experience working in a semiconductor, microelectronics, quantum technology or other advanced R&D environment.




• Experience developing or improving assembly, test or manufacturing processes.

Benefits

• Be part of a creative, world‑leading team working on technology that could transform computing




• Work hands‑on with cutting‑edge quantum hardware and advanced packaging technologies




• Competitive salary and share options scheme




• Contributory pension scheme




• Group private medical insurance scheme




• Choose your own laptop/kit




• Life Assurance




• Cycle‑to‑work Scheme




• Flexible working




• Central London location

EEO Statement

Quantum Motion is committed to providing equal employment opportunity and does not discriminate based on age, sex, sexual orientation, gender identity, race, colour, religion, disability status, marital status, pregnancy, gender reassignment or any other protected characteristics covered by the Equality Act 2010.

Internal Job Reference Number

QSiP0001