Lead, 3D Integration & Quantum Packaging

Quantum; City of Westminster; On-site; GBP 140,000 - 190,000; Full time

Benefits offered by this job

Competitive salary and share options

Contributory pension scheme

Group private medical insurance scheme

Life Assurance

Cycle-to-work Scheme

Central London location

Job summary

Quantum Motion in London is seeking a senior packaging and systems leader to drive R&D of 3D integrated circuits and multi-chip quantum modules, using TSVs and microbumps to perform at millikelvin temperatures. You will recruit and mentor a cross-disciplinary team, oversee external foundries and OSATs, and co-optimize electro-thermal-mechanical designs with cryogenic and quantum hardware groups.

Join a fast-growing scale-up with Islington-based hub, a track record of breakthroughs, and a strong

Qualifications

• 7+ years deep technical experience in 3D integration with TSVs and microbumps.
• Proven track record building and scaling engineering teams in fast-paced environments.
• Experience with external semiconductor foundries or advanced packaging facilities.

Responsibilities

• Recruit, mentor, and lead a multi-discipline team of engineers.
• Drive strategy, design, and rapid prototyping of 3D ICs and multi-chip modules.
• Ensure packaging can withstand millikelvin thermal cycling without degradation.
• Own external transfers to manufacturing lines and coordinate with OSATs.
• Co-optimise electrical, thermal, and mechanical design with cryogenic hardware teams.
• Balance rapid prototyping with yield improvement, failure analysis, and reliability.
• Collaborate with cryo R&D and quantum physics teams; oversee tech transfers.

Skills

3D integration

TSVs & microbumps

Signal integrity

Cryogenic electronics

External foundry collaboration

Ansys HFSS

Ansys Q3D

Cadence

Quantum mechanics basics

Silicon spin qubits

Materials science

Education

Master's or PhD in electrical engineering, materials science, physics, microelectronics, or related field

Tools

Ansys HFSS

Ansys Q3D

Cadence

Job description

Quantum Motion in London is seeking a senior packaging and systems leader to drive R&D of 3D integrated circuits and multi-chip quantum modules, using TSVs and microbumps to perform at millikelvin temperatures. You will recruit and mentor a cross-disciplinary team, oversee external foundries and OSATs, and co-optimize electro-thermal-mechanical designs with cryogenic and quantum hardware groups.

Join a fast-growing scale-up with Islington-based hub, a track record of breakthroughs, and a strong