Principal Semiconductor Packaging Engineer

JR United Kingdom; York; On-site; GBP 50,000 - 80,000; Full time

Job summary

A leading Oxford-based client is seeking a Principal Semiconductor Packaging Engineer to oversee the packaging roadmap for quantum processors. The role includes developing cutting-edge packaging methods, managing supplier relationships, and ensuring optimal thermal performance. This position requires significant expertise in semiconductor packaging and excellent communication skills.

Qualifications

• Experience with semiconductor/photonic packaging methods required.
• Knowledge of die bonding for thermal performance necessary.
• Ability to communicate effectively with suppliers and teams.

Responsibilities

• Steering the packaging roadmap for quantum processor devices.
• Developing wirebond and bumping methods.
• Designing and supervising failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics packaging methods

Die bonding methods

Internal communication skills

External communication skills

Job description

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Principal Semiconductor Packaging Engineer, york

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Client:

IC Resources

Location:

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.