Graduate MEMS Packaging Engineer

JR United Kingdom; Cheltenham; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading technology startup is seeking a Graduate MEMS Packaging Engineer to join its Operations team in Edinburgh. This role offers recent graduates an opportunity to gain hands-on experience while working on cutting-edge MEMS and antenna technologies. The ideal candidate will have a relevant engineering degree and a strong problem-solving mindset, along with experience in semiconductor packaging or related fields.

Qualifications

• Degree in Electronics, Mechanical Engineering, Materials Science, or a related discipline.
• Strong grasp of fundamental engineering principles (DOE, basic statistics).
• Exposure to semiconductor packaging or MEMS technologies is beneficial.

Responsibilities

• Support the development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in the design and execution of reliability tests.

Skills

Problem solving mind-set

Strong grasp of fundamental engineering principles

Exposure to semiconductor packaging

Exposure to MEMS technologies

Exposure to RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

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Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.