Graduate MEMS Packaging Engineer

JR United Kingdom; Swindon; On-site; GBP 25,000 - 35,000; Full time

Job summary

A UK-based technology startup is looking for a Graduate MEMS Packaging Engineer to join its Operations team. This role offers recent graduates an opportunity to work hands-on within a fast-paced environment, assisting in the development and testing of cutting-edge MEMS packaging. Candidates should possess a relevant degree and demonstrate a problem-solving mindset, along with some exposure to semiconductor or RF technologies.

Qualifications

• Degree required in Electronics, Mechanical Engineering, or related field.
• Strong grasp of DOE and basic statistics.
• Exposure to semiconductor packaging is beneficial.

Responsibilities

• Support development of MEMS and antenna packaging processes.
• Conduct lab-based tests and design reliability tests.

Skills

Fundamental engineering principles

Problem-solving

Semiconductor packaging

MEMS technologies

RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, Swindon, Wiltshire

Client: IC Resources

Location: Swindon, Wiltshire, United Kingdom

Job Category: Other

EU work permit required: Yes

Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

Job Description:

Our Edinburgh-based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role involves supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab-based tests and participating in the design and execution of reliability tests will be key responsibilities.

Required skills for the Graduate MEMS Packaging Engineer include:

• Strong grasp of fundamental engineering principles (DOE, basic statistics)
• Problem-solving mindset
• Exposure to semiconductor packaging, MEMS, or RF technologies (beneficial)
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.