Graduate MEMS Packaging Engineer

JR United Kingdom; Oxford; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading company in the tech sector is seeking a Graduate MEMS Packaging Engineer to join their Operations team. This position offers an excellent opportunity for recent graduates to gain hands-on experience in a fast-paced environment, focusing on the development of packaging processes for MEMS and related technologies. Ideal candidates will hold a relevant degree and possess problem-solving skills, with any exposure to semiconductor packaging seen as advantageous. Apply now to kickstart your career in a high-impact technology startup.

Qualifications

• Recent graduate with degree in a relevant engineering discipline.
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial.

Responsibilities

• Support the development of MEMS and antenna subassembly packaging processes.
• Conduct lab based tests and participate in reliability tests design and execution.

Skills

Problem solving mind-set

Strong grasp of fundamental engineering principals

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

Location:

oxford district, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.