Graduate MEMS Packaging Engineer

JR United Kingdom; Northampton; On-site; GBP 25,000 - 35,000; Full time

Job summary

A thriving technology startup in the UK is seeking a Graduate MEMS Packaging Engineer to join their Operations team. This is an exceptional opportunity for new graduates to gain hands-on experience in MEMS technology, focusing on packaging processes and reliability testing in a dynamic environment. Ideal candidates will possess a relevant engineering degree and a strong problem-solving mindset.

Qualifications

• Bachelor's degree in Electronics, Mechanical Engineering, or a related field.
• Strong grasp of engineering principles and problem-solving skills.
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and execute reliability tests.

Skills

Problem solving mind-set

Fundamental engineering principles

Basic statistics

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, northampton

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Client:

IC Resources

Location:

northampton, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.