Graduate MEMS Packaging Engineer

JR United Kingdom; Wolverhampton; On-site; GBP 25,000 - 35,000; Full time

Job summary

A technology startup based in Edinburgh is seeking a Graduate MEMS Packaging Engineer. This role offers recent graduates a chance to gain hands-on experience in packaging processes and materials while contributing to innovative projects in a dynamic environment. Candidates will work closely with the Operations team to support various engineering tasks.

Qualifications

• Recent graduate with a degree in Electronics, Mechanical Engineering, or a related field.
• Exposure to semiconductor packaging, MEMS, or RF technologies is beneficial.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in reliability tests.

Skills

Problem-solving mindset

Strong grasp of fundamental engineering principles

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

Social network you want to login/join with:

Client:

IC Resources

Location:

Job Category:

Other

EU work permit required:

Yes

Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab-based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer include:

• Strong grasp of fundamental engineering principles (DOE, basic statistics)
• Problem-solving mindset
• Exposure to semiconductor packaging, MEMS, or RF technologies is beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.