Senior PCB & IC Packaging Lead — High-Speed FPGA

NanoXplore SAS; Sèvres; On-site; EUR 90,000 - 150,000; Full time

Benefits offered by this job

Health insurance

Company savings plan

5 weeks paid vacation + 12 days extra

Job summary

NanoXplore SAS seeks an experienced Senior PCB and Advanced IC Packaging Engineering Lead to steer a high-performance team. You will drive co-design methodologies for complex mixed-signal ICs, from architecture to fabrication release, in a fast-paced environment.

You will mentor engineers, optimize substrate layout, and own hardware design for advanced packaging while collaborating with ASIC/FPGA teams to ensure robust performance and reliable tape-outs.

Qualifications

• 8+ years of hands-on experience in high-density PCB design or advanced IC packaging.
• Proven track record as a technical leader or lead engineer.

Responsibilities

• Lead, mentor, and guide an agile team of PCB layout and package design engineers.
• Drive SI/PI engineering practices across designs and collaborate with simulation teams.
• Own substrate floorplanning, pin-out optimization, and layout execution during interim period.
• Oversee end-to-end design of advanced FCBGA substrates and multi-chip modules.

Skills

Cross-functional leadership

Strong communication skills

Leadership of agile hardware teams

Education

Bachelor's or Master's in Electrical Engineering or Microelectronics

Tools

Cadence Allegro PCB Editor

Cadence Virtuoso / SiP Layout

Job description

NanoXplore SAS seeks an experienced Senior PCB and Advanced IC Packaging Engineering Lead to steer a high-performance team. You will drive co-design methodologies for complex mixed-signal ICs, from architecture to fabrication release, in a fast-paced environment.

You will mentor engineers, optimize substrate layout, and own hardware design for advanced packaging while collaborating with ASIC/FPGA teams to ensure robust performance and reliable tape-outs.