Head of PCB & IC Packaging Engineer (w/m)

NanoXplore SAS; Sèvres; On-site; EUR 90,000 - 150,000; Full time

Benefits offered by this job

Health insurance

Company savings plan

5 weeks paid vacation + 12 days extra

Job summary

NanoXplore SAS seeks an experienced Senior PCB and Advanced IC Packaging Engineering Lead to steer a high-performance team. You will drive co-design methodologies for complex mixed-signal ICs, from architecture to fabrication release, in a fast-paced environment.

You will mentor engineers, optimize substrate layout, and own hardware design for advanced packaging while collaborating with ASIC/FPGA teams to ensure robust performance and reliable tape-outs.

Qualifications

• 8+ years of hands-on experience in high-density PCB design or advanced IC packaging.
• Proven track record as a technical leader or lead engineer.

Responsibilities

• Lead, mentor, and guide an agile team of PCB layout and package design engineers.
• Drive SI/PI engineering practices across designs and collaborate with simulation teams.
• Own substrate floorplanning, pin-out optimization, and layout execution during interim period.
• Oversee end-to-end design of advanced FCBGA substrates and multi-chip modules.

Skills

Cross-functional leadership

Strong communication skills

Leadership of agile hardware teams

Education

Bachelor's or Master's in Electrical Engineering or Microelectronics

Tools

Cadence Allegro PCB Editor

Cadence Virtuoso / SiP Layout

Job description

Join NanoXplore and help build Europe's critical technologies of tomorrow!

About the Role

We are looking for an experienced and highly driven Senior PCB and Advanced IC Packaging Engineering Lead to join our silicon development team. In this role, you will lead a specialized PCB and advanced IC packaging engineering team working at the cutting edge of high-performance FPGAs, radiation-tolerant solutions, and advanced high-speed RF data converters. As both a manager and a technical lead, you will drive advanced co-design methodologies for complex mixed-signal ICs, managing team deliverables from architecture through fabrication release in a fast-paced environment.

Responsibilities

• Lead, mentor, and foster a collaborative environment for an agile team of PCB layout and package design engineers, providing direct technical guidance and oversight;
• Drive signal integrity (SI) and power integrity (PI) engineering practices across all designs, collaborating closely with simulation teams to ensure robust electrical performance, low jitter, and clean power distribution networks
• Serve as the primary hands-on IC package designer during an interim period, owning substrate floorplanning, pin-out optimization, and layout execution until a dedicated designer is onboarded
• Own and drive end-to-end team deliverables, including the physical design of advanced FCBGA substrates and multi-chip modules, characterization boards, and evaluation kits
• Review and critique hardware designs for ATE load boards and probe cards, ensuring testability and signal fidelity
• Serve as the technical authority for physical implementation, establishing architectural guidelines, layout methodologies, and best practices across the team
• Drive design rules, layout methodologies, and DFx standards tailored to harsh environments and high-reliability requirements
• Collaborate closely with ASIC/FPGA design to optimize stack-up and substrate routing
• Manage suppliers and PCB fabrication vendor relationships and technical interfaces to ensure seamless tape-out and quality of production delivery
• Establish robust revision control, library management, and schematic-to-layout verification flows to eliminate ECO iterations

Qualifications

• Bachelor's or Master’s degree in Electrical Engineering, Microelectronics, or a related technical discipline
• 8+ years of hands-on experience in high-density PCB design or advanced IC packaging, including direct, deep expertise in physical IC package design and a proven track record acting as a technical leader or lead engineer.

Required Skills

• Deep expertise with enterprise EDA layout tools such as Cadence Allegro PCB Editor, Cadence Virtuoso / SiP Layout
• Proven track record of successfully taping out complex, high-layer-count boards and advanced packaging substrates involving high-speed interfaces and tight power delivery networks
• Strong familiarity with manufacturing standards, IPC specifications, and qualification flows for advanced substrates and high-reliability hardware
• Excellent cross-functional communication skills with a methodical approach to supply chain, specialized fabrication houses, and distinct batch-size constraints.

What we offer

• Full-time & permanent contract (CDI) located in one of our 4 sites in Paris, Montpellier, Grenoble or Caen, depending on your location
• Attractive salary according to your profile & experience + internal benefits
• Attractive company savings plan with employer contributions
• High-end health insurance
• 5 weeks of paid vacation + 12 days of additional vacation a year
• Very stimulating work environment, projects and especially teammates!

Join NanoXplore and help build Europe's critical technologies of tomorrow!

At NanoXplore, we design advanced FPGAs, SoCs FPGAs, ASICs and data converters enabling some of Europe's most demanding space, defense, avionics and industrial applications. Our technologies are at the heart of strategic programs that strengthen European technological sovereignty and enable the next generation of high-reliability systems.

What makes us unique?

A rare combination of expertise across both digital and analog design, from radiation-hardened FPGAs to high-performance ADCs and DACs, brought to life by more than 200 passionate

engineers across France.

As a fast-growing European deeptech company

We combine the agility of an entrepreneurial environment with the ambition of a technology leader. Here, you’ll work on complex challenges, cutting-edge innovations, and projects that truly matter.

If you're eager to push the boundaries of microelectronics and contribute to technologies that will shape the future, join us and become part of a team that is not only designing chips but also helping build Europe's technological independence for decades to come!