Quantum Interconnects Process Engineer (Prototype to Production)

Isentroniq; Saint-Germain-en-Laye; Sur place; EUR 85 000 - 120 000; Plein temps

Avantages offerts par ce poste

Equity package

Collaborative culture

Résumé du poste

Isentroniq is seeking a Process Development & Integration Engineer to design the manufacturing route for advanced superconducting interconnects, from concept to working prototypes. You will partner with suppliers for flip‑chip bonding, bumping and packaging, and bring in‑house equipment online to enable rapid prototype production.

You will define process requirements, coordinate trials, and drive improvements while collaborating with quantum, RF and mechanical engineers to ensure system

Qualifications

• PhD or Master’s with at least 5 years hands‑on experience in semiconductor packaging, microelectronics assembly, MEMS packaging, photonics assembly, or related field.
• Hands‑on process knowledge in flip‑chip bonding, solder bumping, die attach, wafer‑level processing, or precision alignment.
• Experience working with external partners (fabrication, bumping, bonding or packaging vendors).
• Process equipment knowledge and experience with bonding, metrology, inspection equipment.
• Comfortable working in a lab, cleanroom or supplier facility.
• Strong communication skills, including English.

Responsabilités

• Define the process and its roadmap with practical flows and acceptance criteria for prototype builds.
• Build the prototype manufacturing route with external partners and coordinate trials for cryo‑bonding and related steps.
• Define requirements for in‑house bonding and metrology equipment; support selection, purchase and operation.
• Review prototype results, perform inspection and failure analysis, and drive iterative improvements.
• Collaborate across quantum, RF and mechanical engineers to meet system requirements.

Connaissances

Flip-chip bonding

Solder bumping

Die attach

Wafer-level processing

Precision alignment

Vendor collaboration

Equipment knowledge

Cleanroom work

English proficiency

Formation

PhD or Master’s degree in a relevant field

Outils

Flip-chip bonders

Optical inspection tools

Profilometers

X-ray systems

Description du poste

Isentroniq is seeking a Process Development & Integration Engineer to design the manufacturing route for advanced superconducting interconnects, from concept to working prototypes. You will partner with suppliers for flip‑chip bonding, bumping and packaging, and bring in‑house equipment online to enable rapid prototype production.

You will define process requirements, coordinate trials, and drive improvements while collaborating with quantum, RF and mechanical engineers to ensure system