Process Development & Integration Engineer

Isentroniq; Saint-Germain-en-Laye; Sur place; EUR 85 000 - 120 000; Plein temps

Avantages offerts par ce poste

Equity package

Collaborative culture

Résumé du poste

Isentroniq is seeking a Process Development & Integration Engineer to design the manufacturing route for advanced superconducting interconnects, from concept to working prototypes. You will partner with suppliers for flip‑chip bonding, bumping and packaging, and bring in‑house equipment online to enable rapid prototype production.

You will define process requirements, coordinate trials, and drive improvements while collaborating with quantum, RF and mechanical engineers to ensure system

Qualifications

• PhD or Master’s with at least 5 years hands‑on experience in semiconductor packaging, microelectronics assembly, MEMS packaging, photonics assembly, or related field.
• Hands‑on process knowledge in flip‑chip bonding, solder bumping, die attach, wafer‑level processing, or precision alignment.
• Experience working with external partners (fabrication, bumping, bonding or packaging vendors).
• Process equipment knowledge and experience with bonding, metrology, inspection equipment.
• Comfortable working in a lab, cleanroom or supplier facility.
• Strong communication skills, including English.

Responsabilités

• Define the process and its roadmap with practical flows and acceptance criteria for prototype builds.
• Build the prototype manufacturing route with external partners and coordinate trials for cryo‑bonding and related steps.
• Define requirements for in‑house bonding and metrology equipment; support selection, purchase and operation.
• Review prototype results, perform inspection and failure analysis, and drive iterative improvements.
• Collaborate across quantum, RF and mechanical engineers to meet system requirements.

Connaissances

Flip-chip bonding

Solder bumping

Die attach

Wafer-level processing

Precision alignment

Vendor collaboration

Equipment knowledge

Cleanroom work

English proficiency

Formation

PhD or Master’s degree in a relevant field

Outils

Flip-chip bonders

Optical inspection tools

Profilometers

X-ray systems

Description du poste

Back to Careers

Process Development & Integration Engineer

We are seeking a Process Development & Integration Engineer to build the manufacturing route for our advanced superconducting interconnects, from first concept to working prototype assemblies. Reporting to our Chief of Engineering, you will work hands‑on with specialist providers in flip‑chip bonding, bumping, and packaging to establish a reliable prototype process. You will also help us select, install, and operate the in‑house equipment that brings this capability home. As the link between our external partners and our quantum, radiofrequency, and mechanical engineers, you will turn system requirements into a practical, fast‑moving development plan.

About Isentroniq

At Isentroniq, we are building the future of computing, not in theory, but in hardware. We enable quantum computing at scale by developing superconducting circuit solutions that increase qubit count by more than 100x at fixed cost and infrastructure size.

We share knowledge openly, challenge ideas constructively, and stay focused on what matters. Our values (gritty ambition with humility, radical candor, surgical audacity, and self‑accountable teamwork) are at the core of how we work and grow.

If you’re passionate about transformative innovation and ready to build the interconnects that make quantum computing at scale possible, join us.

Key Responsibilities

• Define the process and its roadmap. Develop practical process flows, work instructions, and acceptance criteria for prototype builds. Shape a scalable process roadmap as the technology moves from early prototypes toward production‑intent hardware.
• Build the prototype manufacturing route. Work with external partners to develop a rapid path to prototype assemblies, coordinating process trials for cryo‑compatible bump bonding with superconducting metal, flip‑chip bonding, substrate handling, and related assembly steps. Build productive technical relationships with suppliers, and make sure process learning is captured and retained in‑house.
• Bring process capability in‑house. Define requirements for the bonding, metrology and inspection equipment we bring in‑house. Support its selection, purchase, commissioning and day‑to‑day operation.
• Review prototype results and drive improvements. Assess prototype builds with partners and internal teams, and support inspection, testing and failure analysis where required. Identify issues, resolve them quickly and refine the process with each build.
• Integrate across engineering teams. Work closely with our quantum, RF and mechanical engineers so that every assembly meets system requirements.

Who you are

We’re looking for a hands‑on process engineer who knows how advanced packaging really gets done: in the cleanroom, at the supplier’s facility, and on the bonder. You have taken assemblies from requirements to working hardware through external partners, and you know how to keep a programme moving when a process misbehaves. You are comfortable with the ambiguity of deep tech and the pace of an early‑stage prototype programme, where progress comes through iteration.

Key Qualifications

• Background in advanced packaging or assembly. PhD or relevant Master’s degree, with at least 5 years of hands‑on experience in semiconductor packaging, microelectronics assembly, MEMS packaging, photonics assembly, or a related field.
• Hands‑on process knowledge in one or more of: flip‑chip bonding, solder bumping, die attach, wafer‑level processing, or precision alignment.
• Experience working with external partners. You have run process work with fabrication, bumping, bonding or packaging vendors.
• Process equipment experience. You have used or specified equipment such as flip‑chip bonders, optical inspection tools, profilometers or X‑ray systems.
• Comfortable working hands‑on in a lab, cleanroom or supplier facility.
• Strong communication skills to work effectively across internal engineering teams and external partners.
• Communication proficiency in English

Bonus

• Experience with Cryo‑compatible superconducting interconnects or low‑temperature / cryogenic hardware.
• Familiarity with superconducting, radiofrequency, microwave or quantum‑device packaging.
• Experience setting up a new process line, laboratory capability or equipment suite.
• Experience with compliant substrates, flex circuits, thin substrates or fragile MEMS devices.
• Knowledge of process qualification, metrology or failure analysis.
• Proficiency in French

Personal Attributes

• You are a builder. You are hands‑on and not afraid to make things from scratch: process flows, equipment setups, supplier relationships.
• You are pragmatic. You balance technical quality with the urgency of an early‑stage programme. You deliver working prototypes first, rather than chasing perfection on the first attempt.
• You embody an engineer’s mindset, with meticulous attention to detail, a systematic approach to solving process issues, and a drive for continuous process improvement.
• You are autonomous and organized, and enjoy driving a development plan across several partners at once.
• You embody radical candor. You surface problems early, with partners and internally. You welcome having your ideas challenged, and speak openly about both achievements and mistakes.

You thrive in an environment of high expectations, turning uncertainty into structured action.

What We Offer

• A unique opportunity to build the process capability of a cutting‑edge quantum hardware start‑up, from first prototypes to production‑intent hardware.
• The chance to shape Isentroniq’s interconnect manufacturing route and in‑house equipment from the ground up.
• A collaborative, mission‑driven culture with a focus on personal and professional growth.
• Competitive salary and equity package.

Job Type

Permanent position

Location

St-Germain-en-Laye (FR)

Start Date

Now