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VTT in Espoo seeks a Senior Scientist to own the development of superconducting multi-layered wiring for quantum scaling. You will lead the full process stack from development to pilot production, while mentoring colleagues and advancing data-driven improvements.
The role combines strategic roadmapping with hands-on cleanroom work and collaboration with European partners to enable wafer-scale fabrication for future quantum processors.
Are you a seasoned nanofabrication expert ready to take technical ownership of a critical quantum hardware technology? We are offering an opportunity to lead the development of superconducting multi-layered wiring processes from advanced R&D towards scalable, pilot-ready manufacturing. Would you like to shape process roadmaps, mentor colleagues, and remain deeply hands-on in world-class facilities? VTT might be just the place for you.
VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.
You will join our Quantum Scaling and Integration Team and provide technical leadership across the full multi-layered wiring process stack on 200 mm wafers, from process development and integration to yield optimization and pilot-production readiness. In this senior role, you will work with significant autonomy, define technical priorities, lead process scale-up, and guide junior colleagues. You will combine strategic direction with hands-on cleanroom work and data-driven process improvement. Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.
For further information, please contact Research Team Leader Harshad Mishra, harshad.mishra@vtt.fi, +358 50 525 7122
VTT Location: Tietotie 3, Espoo