Quantum Chip Packaging Operator, Flexible Hours

IQM Finland Oy; Espoo; On-site; EUR 36,000 - 48,000; Full time

Job summary

IQM Finland Oy is seeking a Chip Production Operator in Espoo to turn processed chips into test-ready QPU packages. You will work at the handoff between wafer fabrication and final device delivery, ensuring precision and traceability across dicing, cleaning, probing, and bonding.

Initially in a training phase, you’ll learn SOPs station-by-station and progress to running chips independently within six months, while adapting to shift work as needed.

Qualifications

• At least 1 year of hands-on lab experience.
• A degree from a university of applied sciences or equivalent work history.
• Manual precision and fine-motor accuracy for single-chip/ single-wire work.
• Ability to follow mature process instructions and safety protocols.
• Strong attention to detail across complex fabrication steps with safety-first mindset.
• Record of traceable work and respect for colleagues.
• Team-oriented with focus on meeting targets; flexible for shift work.
• Professional English proficiency.

Responsibilities

• Execute chip-level assembly, bonding, and packaging to SOPs and BKMs.
• Operate back-end tools: dicing, cleaning, probing, bonding, sample holder prep, wire bonding.
• Deliver defect-free output with traceable output from diced chip to finished package.
• Move chips through stations to meet daily output without bottlenecks.
• Monitor equipment status and bond quality; intervene before drift causes yield loss.
• Log all checks and results in MES/Jira for real-time traceability.
• Maintain cleanroom discipline: gowning, chemical handling, contamination control.

Skills

Manual precision

Fine motor accuracy

Team player

Shift work ready

Professional English

Education

University of Applied Sciences degree

Tools

Dicing saws

Wire bonders

Flip-chip bonders

Probe stations

MES

Jira

Job description

IQM Finland Oy is seeking a Chip Production Operator in Espoo to turn processed chips into test-ready QPU packages. You will work at the handoff between wafer fabrication and final device delivery, ensuring precision and traceability across dicing, cleaning, probing, and bonding.

Initially in a training phase, you’ll learn SOPs station-by-station and progress to running chips independently within six months, while adapting to shift work as needed.