Precision Chip Packaging Operator (Quantum)

IQM Quantum Computers; Espoo; On-site; EUR 38,000 - 52,000; Full time

Job summary

IQM Quantum Computers in Espoo is seeking a Chip Production Operator to turn diced, front-end processed chips into fully assembled QPU packages. You sit at the handoff point between wafer fabrication and final device delivery, ensuring precision and traceability from diced chip to finished package.

You will train through SOPs, then run chips independently, meet daily targets, and document results in MES and Jira.

Qualifications

• At least 1 year of hands-on lab experience.
• A degree from a university of applied sciences, or equivalent working history.
• Manual precision and fine-motor accuracy; steady hands at single-chip scale.
• Ability to follow mature process instructions and safety protocols exactly.
• Precise attention to detail across fabrication steps with safety-first mindset.
• Habits that keep a traceable record of your own work and respect for colleagues.
• Team-oriented, prioritizing the team's goals.
• Ready to move to shift work when production requires it.
• Professional level English.

Responsibilities

• Execute chip-level assembly, bonding, and packaging operations exactly to SOPs and BKMs
• Operate back-end process tools: dicing, chip cleaning, probing, flip-chip bonding, sample holder preparation, and wire bonding
• Deliver defect-free output at the individual-chip and individual-wire level
• Move assigned chips through each assembly station to meet daily output targets
• Monitor equipment status and bond quality in real time, then intervene or elevate before drift causes yield loss
• Log every station check-in, check-out, and process result in MES and Jira for traceability
• Hold cleanroom discipline: gowning, chemical handling, contamination control
• Flag bonding defects, probe failures, alignment issues, and equipment anomalies to Production Engineer
• Hand over WIP status and tool issues clearly at shift change
• Keep workstations and fixtures to 5S standards; participate in weekly planning and reporting

Skills

Manual dexterity

Attention to detail

Teamwork

English proficiency

Education

Applied sciences degree or equivalent

Tools

Dicing saws

Wire bonders

Flip-chip bonders

Probe stations

Job description

IQM Quantum Computers in Espoo is seeking a Chip Production Operator to turn diced, front-end processed chips into fully assembled QPU packages. You sit at the handoff point between wafer fabrication and final device delivery, ensuring precision and traceability from diced chip to finished package.

You will train through SOPs, then run chips independently, meet daily targets, and document results in MES and Jira.