Chip Production Operator

IQM Finland Oy; Espoo; On-site; EUR 36,000 - 48,000; Full time

Job summary

IQM Finland Oy is seeking a Chip Production Operator in Espoo to turn processed chips into test-ready QPU packages. You will work at the handoff between wafer fabrication and final device delivery, ensuring precision and traceability across dicing, cleaning, probing, and bonding.

Initially in a training phase, you’ll learn SOPs station-by-station and progress to running chips independently within six months, while adapting to shift work as needed.

Qualifications

• At least 1 year of hands-on lab experience.
• A degree from a university of applied sciences or equivalent work history.
• Manual precision and fine-motor accuracy for single-chip/ single-wire work.
• Ability to follow mature process instructions and safety protocols.
• Strong attention to detail across complex fabrication steps with safety-first mindset.
• Record of traceable work and respect for colleagues.
• Team-oriented with focus on meeting targets; flexible for shift work.
• Professional English proficiency.

Responsibilities

• Execute chip-level assembly, bonding, and packaging to SOPs and BKMs.
• Operate back-end tools: dicing, cleaning, probing, bonding, sample holder prep, wire bonding.
• Deliver defect-free output with traceable output from diced chip to finished package.
• Move chips through stations to meet daily output without bottlenecks.
• Monitor equipment status and bond quality; intervene before drift causes yield loss.
• Log all checks and results in MES/Jira for real-time traceability.
• Maintain cleanroom discipline: gowning, chemical handling, contamination control.

Skills

Manual precision

Fine motor accuracy

Team player

Shift work ready

Professional English

Education

University of Applied Sciences degree

Tools

Dicing saws

Wire bonders

Flip-chip bonders

Probe stations

MES

Jira

Job description

At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering. It's complex, demanding, and deeply collaborative. We turn deep research into reliable, full-stack systems that drive discoveries in fields like medicine, energy, and technology, reshaping how the world computes.

Join the team that gives quantum a heartbeat.

The work

As Chip Production Operator, you'll turn diced, front-end processed chips into fully assembled, test-ready QPU packages. You sit at the handoff point between wafer fabrication and final device delivery, where individual chips are singulated, cleaned, electrically verified, and integrated into their sample holders to quantum-grade accuracy. Back-end packaging steps are largely irreversible: what happens at your bench cannot be corrected downstream, so precision is the job.

You’ll join our Micro-Packaging team in QPU Production (Fabrication) in Espoo, reporting to the Team Leader, Micro-packaging, and working daily with production engineers, tech leads, and colleagues across the Fabrication department. The team is taking over the process from dicing onwards while production volume climbs, so we’re hiring two operators. Shift work when production requires it is part of the role.

Your first months are a training phase: you’ll work through the SOPs station by station with the team alongside you. By six months in, you’ll be running chips independently through dicing, cleaning, probing, bonding, and sample holder preparation, with defect-free output and unbroken traceability from diced chip to finished package.

What you’ll actually do

• Execute chip-level assembly, bonding, and packaging operations exactly to established SOPs and BKMs
• Operate back-end process tools: dicing, chip cleaning, probing, flip-chip bonding, sample holder preparation, and wire bonding
• Deliver defect-free output at the individual-chip and individual-wire level, where one misalignment or contamination event can compromise an entire device
• Move assigned chips through each assembly station to meet daily output targets without creating bottlenecks
• Monitor equipment status and bond quality in real time, then intervene or elevate before minor drift becomes yield loss
• Log every station check-in, check-out, and process result in MES and Jira so traceability stays complete and real time
• Hold cleanroom discipline: gowning, chemical handling, and contamination control at the standard fine-pitch bonding demands
• Flag bonding defects, probe failures, alignment issues, and equipment anomalies to the Production Engineer immediately
• Hand over WIP status, in-progress bonds, and tool issues clearly at shift change so chip-level work is never left half done
• Keep workstations, tooling, and fixtures to 5S standards, and take part in weekly planning and reporting meetings

What we’re looking for

• At least 1 year of hands-on lab experience
• A degree from a university of applied sciences, or an equivalent amount of relevant working history
• Manual precision and fine-motor accuracy: steady hands at the single-chip, single-wire scale
• The discipline to follow mature process instructions and safety protocols exactly, in a process where deviations cannot be corrected later
• Precise attention to detail across complex fabrication steps, with a safety-first mindset
• Habits that keep a traceable record of your own work, and respect for the work of the people around you
• A team-oriented person who prioritizes teams' goals and targets
• Readiness to move to shift work when production requires it
• Professional level English

Seen as an advantage

• Cleanroom experience, or hands-on production experience from a related industry such as semiconductors, electronics, or precision assembly
• Familiarity with back-end tools: dicing saws, wire bonders, flip-chip bonders, or probe stations
• Technical communication skills: describing a problem and its fix to people who know the fabrication process broadly but not your step in detail
• Experience with MES or Jira based production tracking

Why IQM?

• Full-stack quantum computing: From quantum hardware to software layers and beyond, we build across the full-stack.
• High-performance playground: We aim high, and we know sustainable performance only works when life outside work does too—hybrid setups, flexible hours.
• Never the smartest: You won’t always be the smartest person in the room. Neither will we. Expect to learn constantly - from each other and beyond with IQM’s Learning Hub, LinkedIn Learning, and a team-based L&D budget.
• Approachable leadership: Flat hierarchy, direct access. Feel free to approach any leaders. They're friendlier than they look!
• The sweet spot: Big enough to matter. Small enough to move fast. Growing between a startup and a corporation. We’re in the phase where top performers get noticed.
• Bigger than IQM: Our people build know-how for the entire quantum ecosystem. We publish papers, run hackathons, and help shape a market that’s still being defined.

The future of computing won’t build itself. You might be one of the few who do.

• Meet our people and learn more about IQM on our stories page.
• Explore our scientific publications.

600M€+ Total Funding | 400+ Team Members | 30+ Quantum Computers Built | 300+ Patents Filed | 10 Locations Globally