Lead, Quantum Backend Packaging & Fabrication

IQM Finland Oy; Espoo; Hybrid; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Hybrid work setup

Learning budget

Flat hierarchy

Team-based collaboration

Job summary

IQM Finland Oy in Espoo seeks a Team Leader, Advanced Packaging, to steer backend fabrication and advanced packaging development for next-generation QPUs. You will bridge early research, proof of concept, process engineering, and production: turning promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production.

You will join QPU Development Engineering, build and lead a new backend and packaging team, and coordinate with Process

Qualifications

• Master's degree in a relevant science or engineering field.
• 5+ years in semiconductor manufacturing, microelectronics, or related high-tech industry.
• 2-3+ years leading technical teams with coaching experience.
• Hands-on backend process development and integration experience.
• Track record of taking technology from concept to production readiness.
• Strong data-driven decision making and problem solving.
• Stakeholder management and cross-functional collaboration.
• Comfort working in an uncertain, fast-moving R&D environment with professional English.

Responsibilities

• Lead, coach, and develop engineers working on backend fabrication, advanced packaging, and process integration.
• Set development priorities and allocate resources against roadmaps and cleanroom capacity.
• Drive technology maturation from research to robust, transferable processes.
• Define development plans, milestones, and process-readiness criteria.
• Guide experiments, review results, and decide next iterations.
• Keep data traceable and aligned with device performance, yield, reliability, and scalability.
• Determine when to hand off to Process Engineering or Production and ensure transfer of specs and training.
• Identify and manage risks, dependencies, and capability gaps to avoid roadmap stalls.
• Collaborate across Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production.
• Maintain visibility of progress, priorities, risks, and decisions with management.

Skills

Leadership

Coaching

Cross-functional collaboration

Data-driven decisions

Project management

Education

Master's degree in materials science/physics/electrical or chemical engineering

Job description

IQM Finland Oy in Espoo seeks a Team Leader, Advanced Packaging, to steer backend fabrication and advanced packaging development for next-generation QPUs. You will bridge early research, proof of concept, process engineering, and production: turning promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production.

You will join QPU Development Engineering, build and lead a new backend and packaging team, and coordinate with Process