Team Leader, Advanced Packaging

IQM Finland Oy; Espoo; Hybrid; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Hybrid work setup

Learning budget

Flat hierarchy

Team-based collaboration

Job summary

IQM Finland Oy in Espoo seeks a Team Leader, Advanced Packaging, to steer backend fabrication and advanced packaging development for next-generation QPUs. You will bridge early research, proof of concept, process engineering, and production: turning promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production.

You will join QPU Development Engineering, build and lead a new backend and packaging team, and coordinate with Process

Qualifications

• Master's degree in a relevant science or engineering field.
• 5+ years in semiconductor manufacturing, microelectronics, or related high-tech industry.
• 2-3+ years leading technical teams with coaching experience.
• Hands-on backend process development and integration experience.
• Track record of taking technology from concept to production readiness.
• Strong data-driven decision making and problem solving.
• Stakeholder management and cross-functional collaboration.
• Comfort working in an uncertain, fast-moving R&D environment with professional English.

Responsibilities

• Lead, coach, and develop engineers working on backend fabrication, advanced packaging, and process integration.
• Set development priorities and allocate resources against roadmaps and cleanroom capacity.
• Drive technology maturation from research to robust, transferable processes.
• Define development plans, milestones, and process-readiness criteria.
• Guide experiments, review results, and decide next iterations.
• Keep data traceable and aligned with device performance, yield, reliability, and scalability.
• Determine when to hand off to Process Engineering or Production and ensure transfer of specs and training.
• Identify and manage risks, dependencies, and capability gaps to avoid roadmap stalls.
• Collaborate across Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production.
• Maintain visibility of progress, priorities, risks, and decisions with management.

Skills

Leadership

Coaching

Cross-functional collaboration

Data-driven decisions

Project management

Education

Master's degree in materials science/physics/electrical or chemical engineering

Job description

At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering. It's complex, demanding, and deeply collaborative. We turn deep research into reliable, full-stack systems that drive discoveries in fields like medicine, energy, and technology, reshaping how the world computes.

Join the team that gives quantum a heartbeat.

The work

As Team Leader, Advanced Packaging, you'll lead the team developing backend fabrication processes and advanced packaging technologies for next-generation QPUs. You own the interface between early-stage research, proof of concept, process engineering, and production: your job is to turn promising concepts into well-understood, reproducible, manufacturable processes that transfer cleanly into production.

You'll join QPU Development Engineering in Espoo, reporting to the Team Leader, QPU Development Engineering, and build up a new, dedicated backend and advanced packaging team. Day to day you'll work with Process Engineering, Equipment, Micro-packaging, Design, System Engineering, Measurement, Reliability, and Quality, alongside our research groups and the cleanroom and facilities teams.

This is leadership on two fronts at once: coaching experienced engineers, and setting technical direction, priorities, and cleanroom capacity calls. In your first six months, you'll have the team’s development plan, milestones, and process-readiness criteria in place, and visible progress on the backend roadmap for the next generation’s QPU packaging.

What you'll actually do

• Lead, coach, and develop the engineers working on backend fabrication, advanced packaging, and process integration
• Set development priorities and allocate resources against QPU roadmaps, project needs, technical risk, and available cleanroom capacity
• Drive technology maturation from research and proof of concept into robust, transferable fabrication processes
• Define development plans, technical milestones, success criteria, and process-readiness expectations
• Guide hypothesis-driven experiments, review results and technical conclusions with the team, and decide the next iteration
• Keep development work data-based, traceable, and tied to QPU and product requirements: device performance, yield, reliability, scalability
• Judge when a process is mature enough to hand to Process Engineering or Production, and make sure the transfer carries specifications, control plans, metrology methods, known limitations, and training
• Identify and manage technical risks, process dependencies, blockers, and capability gaps before they stall the roadmap
• Work across Research, QPU Development, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, and Production to keep backend development aligned
• Keep progress, priorities, risks, resource needs, and key decisions visible to your manager and stakeholders

What we're looking for

• A Master's degree in materials science, physics, electrical or chemical engineering, nanotechnology, microelectronics, or a related discipline
• 5+ years in semiconductor manufacturing, microelectronics, advanced packaging, quantum technologies, or comparable high-tech industry
• 2-3+ years leading technical teams, projects, or multidisciplinary engineering activities, with genuine coaching experience behind you
• Hands-on backend process development and process integration experience, not oversight from a distance
• A track record of taking technology from early phase to engineering or production readiness
• Strong data-driven decision making and structured problem solving: experimental methods, process capability, root cause analysis
• Stakeholder management and cross-functional collaboration, plus the ability to simplify complex technical topics for engineers, production, and senior management alike
• Comfort deciding under uncertainty in a fast-moving R&D environment, and professional level English

Seen as an advantage

• Cleanroom operations and safety leadership experience
• Depth in specific advanced packaging technologies: flip-chip bonding, wafer-level packaging, through-silicon vias, or other fine-pitch integration
• Experience building up a new team or function in a scaling organization
• Familiarity with quantum computing, cryogenics, or other advanced hardware R&D

Why IQM?

• Full-stack quantum computing: From quantum hardware to software layers and beyond, we build across the full-stack.
• High-performance playground: We aim high, and we know sustainable performance only works when life outside work does too - hybrid setups, flexible hours.
• Never the smartest: You won't always be the smartest person in the room. Neither will we. Expect to learn constantly - from each other and beyond with IQM's Learning Hub, LinkedIn Learning, and a team-based L&D budget.
• Approachable leadership: Flat hierarchy, direct access. Feel free to approach any leaders. They're friendlier than they look!
• The sweet spot: Big enough to matter. Small enough to move fast. Growing between a startup and a corporation. We're in the phase where top performers get noticed.
• Bigger than IQM: Our people build know-how for the entire quantum ecosystem. We publish papers, run hackathons, and help shape a market that's still being defined.

The future of computing won't build itself. You might be one of the few who do.

• Meet our people and learn more about IQM on our stories page.
• Explore our scientific publications.

600M€+ Total Funding | 400+ Team Members | 30+ Quantum Computers Built | 300+ Patents Filed | 10 Location Globally