Camera Module Hardware Engineer - Bring-Up & Evaluation

microTECH Global LTD; Tampere; On-site; EUR 60,000 - 85,000; Full time

Job summary

microTECH Global LTD is seeking a hands‑on hardware engineer for our camera module team. You will drive the full development cycle from schematic capture through bring-up, characterization, and evaluation reporting for next‑gen camera modules used in consumer devices.

You will prototype, test, and validate mixed‑signal hardware, including image sensors, VCMs, and power management circuits, while drafting clear reports for engineers and executives alike.

Qualifications

• MSc or PhD in electrical engineering or related field.
• Hands-on electronics hardware engineering experience in consumer/mobile devices.
• Solid PCB design skills: schematic capture, layout, routing, signal integrity, EMI awareness.
• Bench readiness for soldering, probing, and measurement.

Responsibilities

• Designing, prototyping, and testing camera module assemblies for next-gen smartphones.
• Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes.
• Soldering, probing, and measuring at the lab bench.

Skills

PCB design

Schematic capture

Lab bench work

Firmware basics (I2C, SPI, MIPI CSI-2)

Signal integrity

English communication

Education

MSc in Electrical Engineering

PhD advantageous

Tools

Oscilloscope

Altium

KiCad

Job description

microTECH Global LTD is seeking a hands‑on hardware engineer for our camera module team. You will drive the full development cycle from schematic capture through bring-up, characterization, and evaluation reporting for next‑gen camera modules used in consumer devices.

You will prototype, test, and validate mixed‑signal hardware, including image sensors, VCMs, and power management circuits, while drafting clear reports for engineers and executives alike.