Camera Module Hardware Engineer – Bring-Up & SI Expert

microTECH Global LTD; Finland; Remote; EUR 60,000 - 90,000; Full time

Job summary

microTECH Global Limited in Finland is seeking a hands-on Camera Module Hardware Engineer to drive the full development cycle from schematic capture to bring-up and evaluation reporting.

You will design, prototype, and test camera module assemblies for next-generation devices, own PCB layout, bring up sensors, actuators, and PMICs, and configure image sensors via I2C/SPI/MIPI CSI-2 while generating rigorous findings for peers and executives.

Qualifications

• MSc or PhD in electrical engineering or related field.
• Hands-on electronics hardware engineering experience.
• Solid grounding in PCB design with SI and EMI awareness.
• Bench skills: solder, probe, measure without hesitation.
• Experience bringing up mixed-signal systems and sensors.
• Firmware-level control via I2C, SPI, MIPI CSI-2.
• Strong written English communication.
• Fluency in English, written and spoken.

Responsibilities

• Designing, prototyping, and testing camera module assemblies for smartphones.
• Capturing schematics and owning PCB layout for evaluation boards.
• Lab work: soldering, wiring, probing, and measuring.
• Bringing up image sensors, actuators, and PMICs from scratch.
• Configuring sensors and actuators at firmware level (I2C/SPI/MIPI CSI-2).
• Running electrical measurements to validate designs and diagnose issues.
• Performing simulations across electrical, EMI, and signal integrity domains.
• Translating findings into clear evaluation reports for engineers and executives.

Skills

PCB design

Signal integrity

EMI considerations

Bench soldering

Firmware control (I2C/SPI)

Image sensors

Lab measurements

Documentation

English communication

Research & bring-up

Education

MSc or PhD in Electrical Engineering

Tools

PCB CAD (Altium/Eagle)

Oscilloscope

Logic analyzer

Soldering station

Job description

microTECH Global Limited in Finland is seeking a hands-on Camera Module Hardware Engineer to drive the full development cycle from schematic capture to bring-up and evaluation reporting.

You will design, prototype, and test camera module assemblies for next-generation devices, own PCB layout, bring up sensors, actuators, and PMICs, and configure image sensors via I2C/SPI/MIPI CSI-2 while generating rigorous findings for peers and executives.