Camera Module (Hardware) Consultant - Finland (Contract)

microTECH Global LTD; Finland; Remote; EUR 60,000 - 90,000; Full time

Job summary

microTECH Global Limited in Finland is seeking a hands-on Camera Module Hardware Engineer to drive the full development cycle from schematic capture to bring-up and evaluation reporting.

You will design, prototype, and test camera module assemblies for next-generation devices, own PCB layout, bring up sensors, actuators, and PMICs, and configure image sensors via I2C/SPI/MIPI CSI-2 while generating rigorous findings for peers and executives.

Qualifications

• MSc or PhD in electrical engineering or related field.
• Hands-on electronics hardware engineering experience.
• Solid grounding in PCB design with SI and EMI awareness.
• Bench skills: solder, probe, measure without hesitation.
• Experience bringing up mixed-signal systems and sensors.
• Firmware-level control via I2C, SPI, MIPI CSI-2.
• Strong written English communication.
• Fluency in English, written and spoken.

Responsibilities

• Designing, prototyping, and testing camera module assemblies for smartphones.
• Capturing schematics and owning PCB layout for evaluation boards.
• Lab work: soldering, wiring, probing, and measuring.
• Bringing up image sensors, actuators, and PMICs from scratch.
• Configuring sensors and actuators at firmware level (I2C/SPI/MIPI CSI-2).
• Running electrical measurements to validate designs and diagnose issues.
• Performing simulations across electrical, EMI, and signal integrity domains.
• Translating findings into clear evaluation reports for engineers and executives.

Skills

PCB design

Signal integrity

EMI considerations

Bench soldering

Firmware control (I2C/SPI)

Image sensors

Lab measurements

Documentation

English communication

Research & bring-up

Education

MSc or PhD in Electrical Engineering

Tools

PCB CAD (Altium/Eagle)

Oscilloscope

Logic analyzer

Soldering station

Job description

You'll be an integral member of our Camera Module Hardware team, working hands-on across the full development cycle — from early schematic capture through bring-up, characterization, and evaluation reporting — and we're looking for an engineer passionate about delivering novel, high-quality hardware for millions of users.

Job Descriptions:

• Designing, prototyping, and testing camera module assemblies for next-generation smartphones
• Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes
• Getting hands-on in the lab: soldering, wiring, probing, and measuring — you'll know your way around a bench
• Bringing up image sensors, actuators, and power management circuits from scratch
• Configuring image sensors and actuators at the firmware level, including still image and video streaming pipelines
• Running a full suite of electrical measurements — analog and digital — to validate designs and chase down root causes
• Performing simulations across electrical, electromagnetic, EMI, and signal integrity domains
• Translating findings into clear, rigorous evaluation reports for engineering peers and executive stakeholders

Qualifications and detailed requirements:

• MSc or PhD degree in electrical engineering or other relevant fields
• Hands-on experience in electronics hardware engineering, ideally in consumer electronics or mobile
• Solid grounding in PCB design — schematic capture, layout, and routing — with a practical understanding of signal integrity and EMI considerations
• Comfortable at the bench: you solder, probe, and measure without hesitation
• Experience bringing up mixed-signal systems, including image sensors, VCMs, or power management ICs
• Some exposure to firmware-level device control (I²C, SPI, MIPI CSI-2, or similar)
• Strong written communication — you can write a teardown report that's effective both at engineering and executive levels
• Fluent in English, both written and spoken
• Big advantage for contestants from international competitions in computer science, mathematics, or physics (e.g. IOI, IMO, ICPC, IPhO, IChO)

Nice to Have Skills:

• Hands-on experience with camera module characterization (MTF, noise, OIS performance, etc.)
• Familiarity with MIPI standards or ISP tuning workflows
• Able to run simulations and interpret results across electrical and EM domains
• Experience in a fast-paced, high-ownership engineering environment