Camera Module (Hardware) Consultant - Finland (Contract)

microTECH Global LTD; Tampere; On-site; EUR 60,000 - 85,000; Full time

Job summary

microTECH Global LTD is seeking a hands‑on hardware engineer for our camera module team. You will drive the full development cycle from schematic capture through bring-up, characterization, and evaluation reporting for next‑gen camera modules used in consumer devices.

You will prototype, test, and validate mixed‑signal hardware, including image sensors, VCMs, and power management circuits, while drafting clear reports for engineers and executives alike.

Qualifications

• MSc or PhD in electrical engineering or related field.
• Hands-on electronics hardware engineering experience in consumer/mobile devices.
• Solid PCB design skills: schematic capture, layout, routing, signal integrity, EMI awareness.
• Bench readiness for soldering, probing, and measurement.

Responsibilities

• Designing, prototyping, and testing camera module assemblies for next-gen smartphones.
• Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes.
• Soldering, probing, and measuring at the lab bench.

Skills

PCB design

Schematic capture

Lab bench work

Firmware basics (I2C, SPI, MIPI CSI-2)

Signal integrity

English communication

Education

MSc in Electrical Engineering

PhD advantageous

Tools

Oscilloscope

Altium

KiCad

Job description

You'll be an integral member of our Camera Module Hardware team, working hands-on across the full development cycle — from early schematic capture through bring-up, characterization, and evaluation reporting — and we're looking for an engineer passionate about delivering novel, high-quality hardware for millions of users.

Job Descriptions:

• Designing, prototyping, and testing camera module assemblies for next-generation smartphones
• Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes
• Getting hands-on in the lab: soldering, wiring, probing, and measuring — you'll know your way around a bench
• Bringing up image sensors, actuators, and power management circuits from scratch
• Configuring image sensors and actuators at the firmware level, including still image and video streaming pipelines
• Running a full suite of electrical measurements — analog and digital — to validate designs and chase down root causes
• Performing simulations across electrical, electromagnetic, EMI, and signal integrity domains
• Translating findings into clear, rigorous evaluation reports for engineering peers and executive stakeholders

Qualifications and detailed requirements:

• MSc or PhD degree in electrical engineering or other relevant fields
• Hands‑on experience in electronics hardware engineering, ideally in consumer electronics or mobile
• Solid grounding in PCB design — schematic capture, layout, and routing — with a practical understanding of signal integrity and EMI considerations
• Comfortable at the bench: you solder, probe, and measure without hesitation
• Experience bringing up mixed‑signal systems, including image sensors, VCMs, or power management ICs
• Some exposure to firmware‑level device control (I²C, SPI, MIPI CSI‑2, or similar)
• Strong written communication — you can write a teardown report that's effective both at engineering and executive levels
• Fluent in English, both written and spoken
• Big advantage for contestants from international competitions in computer science, mathematics, or physics (e.g. IOI, IMO, ICPC, IPhO, IChO)

Nice to Have Skills:

• Hands‑on experience with camera module characterization (MTF, noise, OIS performance, etc.)
• Familiarity with MIPI standards or ISP tuning workflows
• Able to run simulations and interpret results across electrical and EM domains
• Experience in a fast‑paced, high‑ownership engineering environment