Senior MEMS Packaging & Test Automation Lead

NeuroTechX; Barcelona; Presencial; EUR 75.000 - 110.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Private Health Insurance

23 vacation days per year

Christmas week off

Office-based in Bellaterra

Descripción de la vacante

INBRAIN seeks a Senior MEMS Advanced Packaging Engineer in Barcelona/Bellaterra to architect metrology and data infrastructure for 3D MEMS processes. You will lead test setups, DOE-driven characterization, and data pipelines in Python, coordinating across packaging, hardware and software teams to industrialize pilot to production.

The role requires hands-on MEMS testing expertise, strong data-analysis skills, and a track record of industrializing test platforms.

Formación

• Bachelor’s or Master’s in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or related field.
• 5+ years in Test Development, Device Characterization, or Yield Engineering in semiconductor, MEMS, or advanced packaging.
• Vertical Integration & MEMS Expertise: hands-on with testing advanced packaging architectures including wafer-level bonding, TGV/TSV, and reliability.
• Data Science & Scripting: Python (Pandas, NumPy, SciPy) for data analysis, instrument control, and automating workflows.
• Test Equipment & Instrumentation: hands-on with SMUs, DAQs, oscilloscopes, and dedicated MEMS test rigs.
• Physics of Failure: understanding interface failures to design accurate test traps.
• Industrialization Track Record: taking prototype test platforms to pilot/production with SOPs and IQ/OQ/PQ.
• Systematic, first-principles approach to problem-solving.

Responsabilidades

• Test Strategy & Equipment Setup: define and deploy test infrastructure for 3D MEMS process steps.
• Process Characterization & DOEs: design/execute experiments to set process windows and acceptance criteria.
• Data Analysis & Industrialization: build Python-based data pipelines to analyze high-volume data.
• Hardware & Electrical Characterization: lead electrical/physical characterization with SMUs, DAQs, scopes.
• Materials & Failure Analysis: root-cause analysis on failures across bonding, packaging, TGV interfaces.
• Cross-Functional Coordination: collaborate with Process Integration, Packaging, Hardware, Software teams.
• Industrialization & Scaling: move prototype test setups to pilot/production; write SOPs; IQ/OQ/PQ.
• Continuous Improvement: reduce variation and improve test throughput.

Conocimientos

Python scripting

Data analysis

Test development

Electrical test

MEMS testing

Industrialization

DOE design

Educación

Electrical Engineering / related

Herramientas

SMUs

DAQs

Oscilloscopes

Probe stations

SCPI/VISA

Python for automation

Descripción del empleo

INBRAIN seeks a Senior MEMS Advanced Packaging Engineer in Barcelona/Bellaterra to architect metrology and data infrastructure for 3D MEMS processes. You will lead test setups, DOE-driven characterization, and data pipelines in Python, coordinating across packaging, hardware and software teams to industrialize pilot to production.

The role requires hands-on MEMS testing expertise, strong data-analysis skills, and a track record of industrializing test platforms.