Senior MEMS Packaging Engineer - Test & Automation

Inbrain Neuroelectronics; Bellprat; Presencial; EUR 90.000 - 120.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Private Health Insurance

23 vacation days

Christmas week off

Office in Bellaterra

Descripción de la vacante

Inbrain Neuroelectronics seeks a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis infra. You will design automated test systems for 3D MEMS processes, drive DOE studies and translate findings into reliable production-ready tests.

Lead hardware characterization using SMUs, DAQs and probes, and collaborate with Process Integration, Packaging, Hardware and Software teams to scale from R&D to production.

Formación

• 5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging environment.
• Vertical Integration & MEMS Expertise: hands-on testing and characterization of advanced packaging architectures.
• Data Science & Scripting: strong Python (Pandas, NumPy, SciPy) for data analysis and instrument control.

Responsabilidades

• Test Strategy & Equipment Setup: define and deploy test infrastructure for 3D MEMS processes and reliability testing.
• Process Characterization & DOEs: design experiments to set process windows and acceptance criteria.
• Data Analysis & Industrialization: build Python data pipelines to extract yield, drift, and failure signatures and iterate recipes.
• Hardware & Electrical Characterization: lead characterization using SMUs, DAQs, oscilloscopes, probe stations.
• Materials & Failure Analysis: root-cause analysis across bonding, packaging, TGV interfaces.
• Cross-Functional Coordination: align test requirements with Process Integration, Packaging, Hardware, and Software teams.
• Industrialization & Scaling: take prototype test setups to pilot/production with SOPs and IQ/OQ/PQ.

Conocimientos

Test Development

Device Characterization

Yield Engineering

Vertical Integration

MEMS Expertise

Python scripting

Test Equipment

Physics of Failure

Industrialization

Educación

Electrical Engineering or related field

Herramientas

SMUs & DAQs

Oscilloscopes

Probe stations

MEMS test rigs

Descripción del empleo

Inbrain Neuroelectronics seeks a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis infra. You will design automated test systems for 3D MEMS processes, drive DOE studies and translate findings into reliable production-ready tests.

Lead hardware characterization using SMUs, DAQs and probes, and collaborate with Process Integration, Packaging, Hardware and Software teams to scale from R&D to production.