Senior MEMS Advanced Packaging Engineer

Inbrain Neuroelectronics; Barcelona; Presencial; EUR 90.000 - 120.000; Jornada completa

Descripción de la vacante

Inbrain Neuroelectronics in Bellaterra is seeking a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis for 3D MEMS processes. You will lead test strategy, infrastructure setup and data-driven improvements across packaging, TGV/TWV interfaces and reliability.

The role emphasizes Python-based data pipelines, cross-functional collaboration, and the industrialization of prototype test platforms for pilot and production, with a strong focus on test

Formación

• Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or related field.
• 5+ years in Test Development, Device Characterization, or Yield Engineering within semiconductor/MEMS environments.
• Experience with wafer-level packaging architectures and MEMS reliability is a plus.
• Strong Python skills for data analysis and automation of high-volume workflows.

Responsabilidades

• Define and deploy test infrastructure for 3D MEMS process steps including thermal bonding and TGV/TSV work.
• Design structured DOEs to set process windows and acceptance criteria across steps.
• Build Python data pipelines to analyze large process/test datasets and extract key metrics.
• Lead electrical and physical characterization using SMUs, DAQs, scopes, and MEMS rigs.
• Collaborate cross-functionally to industrialize prototype test setups for pilot/production.
• Author SOPs and qualify equipment (IQ/OQ/PQ) and integrate with MES where applicable.
• Identify opportunities to reduce variation and improve test throughput.

Conocimientos

Test Development

Device Characterization

Yield Engineering

Python Data

SCPI/VISA

MEMS Expertise

Industrialization

DOE Design

Educación

Electrical Engineering

Materials Science

Herramientas

SMUs & DAQs

Oscilloscopes

Probe Stations

MEMS Test Rigs

Descripción del empleo

Your mission

We are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain disorders. INBRAIN harnesses the extraordinary material properties of Graphene, the world’s thinnest and nobel-prize winning material, to build safe, uninvasive and highly efficient neural solutions. Our mission is to decode and modulate neural networks to improve people's lives. As a Senior MEMS Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability). You will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in people´s lives worldwide. This position will be office-based in Bellaterra.

Your profile

Main responsibilities:

• Test Strategy & Equipment Setup: Define and deploy the test infrastructure required to characterize 3D MEMS process steps thermal bonding, wafer-level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate metrology, electrical test, and reliability equipment.
• Process Characterization & DOEs: Design and execute structured experiments to characterize 3D MEMS unit processes and integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled process steps.
• Data Analysis & Industrialization: Build Python-based data pipelines to analyze high-volume process and test data. Extract yield, Cpk, drift, and failure-mode signatures. Translate findings directly into process and test recipe improvements.
• Hardware & Electrical Characterization: Lead electrical and physical characterization across 3D MEMS structures. Use SMUs, DAQs, oscilloscopes, probe stations, and dedicated MEMS test rigs to measure critical parameters at the required precision.
• Materials & Failure Analysis: Apply materials science fluency, thin films, interfaces, integration physics, to root-cause analysis on failures across, bonding, packaging, TGV interfaces and electromechanical reliability. Feed findings back to process and design teams to drive iterations.
• Cross-Functional Coordination: Work directly with Process Integration, Packaging, Hardware, mechanical and Software teams to align test requirements, hardware specifications, and data infrastructure. Translate 3D MEMS physics into testable specifications across disciplines.
• Industrialization & Scaling: Take prototype test setups out of R&D and harden them for pilot and production. Author SOPs, qualify equipment (IQ / OQ / PQ), and integrate with MES where applicable.
• Continuous Improvement: Identify opportunities to reduce variation, improve test throughput, and tighten the link between process control and electrical / yield outcomes across the 3D MEMS stack.

Mandatory Qualifications and Soft skills:

• Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or a related field.
• 5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging environment.
• Vertical Integration & MEMS Expertise: Hands-on experience with testing and characterizing advanced packaging architectures, including wafer-level thermal bonding, Through-Glass Vias (TGV) / TSV metallization, and electromechanical reliability.
• Data Science & Scripting: High proficiency in Python (e.g., Pandas, NumPy, SciPy) for complex data analysis, instrument control (SCPI/VISA), and automating high-volume, lot-level data workflows.
• Test Equipment & Instrumentation: Hands-on expertise building test setups with SMUs, DAQs, oscilloscopes, and automated metrology tools. Highly capable of debugging signal integrity for low-noise/high-impedance analog measurements.
• Physics of Failure: Deep understanding of semiconductor/MEMS device physics, thin films, and electromechanical integration. Must understand why an interface fails (e.g., CTE mismatch, delamination, voiding) to design accurate test traps.
• Industrialization Track Record: Proven ability to take prototype test platforms out of R&D and industrialize them for pilot or production use, including authoring SOPs and executing equipment qualification (IQ/OQ/PQ).
• Systematic, first-principles approach to problem-solving.
• A strong instinct for identifying R&D fragility.
• Strong written and verbal communication.
• Takes full ownership of test strategy, equipment readiness, and data quality.
• Thrives in fast-moving, unstructured deep-tech environments.

Nice to have (optional):

• Database Architecture: Experience interfacing automated test hardware with Manufacturing Execution Systems (MES) or SQL databases, and building visual dashboards (e.g., Grafana, PowerBI) for tracking yield and Cpk.
• Reliability & Environmental Testing: Practical knowledge of accelerated aging models, hermeticity testing (leak rate analysis), and Electrochemical Impedance Spectroscopy (EIS).
• Neurotechnology & Mixed-Signal Electronics: Familiarity with high-channel-count analog front-ends (AFEs), custom ASICs, or complex neural electrophysiology signal chains.
• Statistical Process Control: Working knowledge of PFMEA, DOE methodology, SPC, and Cpk-driven process control in regulated manufacturing environments.
• Pilot-to-Production Scaling: Prior experience supporting a deep-tech hardware company through a pilot-to-production transition, including capital tooling and scale-up decisions.

Why us?

We are looking for someone who Is ready to proactively bring new ideas to the team, push boundaries, and constantly look for innovation. At INBRAIN we believe in shared success and diverse ways of thinking, here you'll learn, grow, and advance in an innovative culture.

WHAT CAN WE OFFER TO YOU?

• Acollaborative environment where innovative ideas flourish and teamwork drives us forward. At