Senior MEMS Packaging & Test Systems Architect

Inbrain Neuroelectronics; Barcelona; Presencial; EUR 90.000 - 120.000; Jornada completa

Descripción de la vacante

Inbrain Neuroelectronics in Bellaterra is seeking a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis for 3D MEMS processes. You will lead test strategy, infrastructure setup and data-driven improvements across packaging, TGV/TWV interfaces and reliability.

The role emphasizes Python-based data pipelines, cross-functional collaboration, and the industrialization of prototype test platforms for pilot and production, with a strong focus on test

Formación

• Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or related field.
• 5+ years in Test Development, Device Characterization, or Yield Engineering within semiconductor/MEMS environments.
• Experience with wafer-level packaging architectures and MEMS reliability is a plus.
• Strong Python skills for data analysis and automation of high-volume workflows.

Responsabilidades

• Define and deploy test infrastructure for 3D MEMS process steps including thermal bonding and TGV/TSV work.
• Design structured DOEs to set process windows and acceptance criteria across steps.
• Build Python data pipelines to analyze large process/test datasets and extract key metrics.
• Lead electrical and physical characterization using SMUs, DAQs, scopes, and MEMS rigs.
• Collaborate cross-functionally to industrialize prototype test setups for pilot/production.
• Author SOPs and qualify equipment (IQ/OQ/PQ) and integrate with MES where applicable.
• Identify opportunities to reduce variation and improve test throughput.

Conocimientos

Test Development

Device Characterization

Yield Engineering

Python Data

SCPI/VISA

MEMS Expertise

Industrialization

DOE Design

Educación

Electrical Engineering

Materials Science

Herramientas

SMUs & DAQs

Oscilloscopes

Probe Stations

MEMS Test Rigs

Descripción del empleo

Inbrain Neuroelectronics in Bellaterra is seeking a Senior MEMS Advanced Packaging Engineer to architect metrology, electrical test and data analysis for 3D MEMS processes. You will lead test strategy, infrastructure setup and data-driven improvements across packaging, TGV/TWV interfaces and reliability.

The role emphasizes Python-based data pipelines, cross-functional collaboration, and the industrialization of prototype test platforms for pilot and production, with a strong focus on test