PICs@ICFO Strategic Initiative: Junior Process Engineer in PIC Packaging

ICFO - The Institute of Photonic Sciences; España; On-site; EUR 30,000 - 42,000; Full time

Benefits offered by this job

State-of-the-art facilities

Family allowance

Hands-on PIC packaging

Job summary

ICFO - The Institute of Photonic Sciences is seeking a Junior Process Engineer in PIC Packaging to advance assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The role involves hands-on work in an advanced R&D pilot-line, developing processes and solving engineering challenges.

The candidate will operate packaging equipment, participate in process development, and collaborate across multidisciplinary teams to deliver scalable solutions for PICs.

Qualifications

• Degree in Electronics, Microelectronics, or Photonics or related field.
• Experience with precision equipment in research, development or industry is highly valued.
• Knowledge of semiconductor processes is a plus.

Responsibilities

• Operate and program assembly equipment for PIC packaging development.
• Develop and optimize die assembly and interconnection processes (die attach, solder reflow, wire bonding).
• Set up and run semi-automated equipment for process development and prototyping.
• Support material, component, and supplier qualification for process compatibility and quality.
• Collaborate with optical, mechanical, RF, and test engineers to implement scalable packaging solutions.

Skills

Precise equipment handling

Team collaboration

Process development

Troubleshooting

Education

Bachelor’s or Master’s in Electronics/Photonics/Microelectronics

Tools

Die attach equipment

Wire bonding equipment

Solder reflow equipment

Semiconductor process equipment

Job description

ICFO - The Institute of Photonic Sciences

Organisation/Company ICFO - The Institute of Photonic Sciences Research Field Engineering » Electronic engineering Researcher Profile Other Profession Positions Other Positions Application Deadline 30 Oct 2026 - 00:00 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Offer Starting Date 2 Oct 2026 Is the job funded through the EU Research Framework Programme? European Union / Next Generation EU Reference Number EC10-002141 Is the Job related to staff position within a Research Infrastructure? No

Offer Description

As part of the PICs@ICFO Strategic Initiative, ICFO is currently coordinating the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project, both major initiatives aimed at advancing Photonic Integrated Circuits (PICs) in Europe. These projects strengthen ICFO's strategic positioning across the entire PIC development pipeline - from design and fabrication to packaging, testing, and real-world applications.

Position Overview

We are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs). The selected candidate will play a key role in the experimental development of advanced PIC technologies within the PICs@ICFO Strategic Initiative.

This is a highly hands-on position in an advanced R&D pilot-line environment, ideally suited for candidates who enjoy working with manufacturing equipment, developing processes, and solving practical engineering challenges.

We welcome applications from motivated candidates eager to learn and grow in the field of photonics packaging.

Key Responsibilities:

The successful candidate will be actively involved in operating and programming assembly equipment, developing manufacturing processes, and troubleshooting technical challenges in an advanced R&D pilot-line environment. Specifically:

• Develop and optimize die assembly and interconnection processes for electronic and photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes.
  
• Set up, program, and operate semi-automated equipment for process development and prototyping.
  
• Support the selection and qualification of materials, components, and suppliers to ensure process compatibility and quality.
  
• Optimize packaging processes through experimental evaluation, including thermo-mechanical integrity and reliability testing (e.g., die shear, wire pull, thermal cycling).
  
• Collaborate closely with multidisciplinary teams including optical, mechanical, RF, and test engineers to implement scalable and manufacturable packaging solutions.
  

This position will report to the Prof. Dr. Valerio Pruneri, Scientific Coordinator of the PICs@ICFO Strategic Initiative encompassing the European Chips JU Pilot Line PIXEurope and the Catalan PhotonChip project.

Applicants must hold FP Grado Superior, Bachelor’s, or Master’s Degree in Electronics, Microelectronics Engineering, Photonics, or a related field.

We are looking for candidates with a proven track record in the following:

• demonstrated experience working with precision equipment and instrumentation, in academics, R&D or industrial environment.
  
• familiarity with semiconductor processes and environment is a plus

The ideal candidate is pragmatic and detail-oriented, collaborative and motivated to work in a multidisciplinary environment bridging research and industrial applications.

Languages ENGLISH Level Excellent

Research Field Engineering » Electronic engineering

Additional Information

What We Offer

• Full-time contract for scientific and technical activities pursuant to Spanish Law 14/2011, linked to the Catalan PhotonChip project.
  
• Access to state-of-the-art facilities for Photonic Packaging and Testing.
  
• Opportunity to develop hands-on expertise in advanced packaging technologies at the interface between academia and industry.
  
• A family allowance may be granted to candidates with dependents, in accordance with ICFO policies.

ICFO is an equal opportunity employer. We hire based solely on merit and potential, regardless of gender, nationality, or disability. ICFO fully endorses the European Charter for Researchers and Code of Conduct for the Recruitment of Researchers, ensuring a transparent and supportive recruitment process.

Selection process

The selection process will consist of:

1. Eligibility check of applications
2. Assessment of merits (education, experience, and language)
3. Interview with shortlisted candidates

The Evaluation Committee will include at least three members and ensure gender balance and impartiality.
Each phase will be documented, and candidates will be notified of the outcome within 15 days of the interview.