Research Associate: Interconnect Technologies (all genders)

Fraunhofer; Dresden; Vor Ort; EUR 55.000 - 68.000; Vollzeit

Benefits dieser Stelle

Job ticket for public transport

Company pension scheme

Flexible working hours

Mobile working

Zusammenfassung

Fraunhofer IPMS is seeking a Research Associate in Interconnect Technologies to advance BEOL metallization and copper line formation using ECD and CMP. The role emphasizes project management, collaboration across CNT groups and industrial partners.

You work in a cutting-edge 300 mm cleanroom environment, participate in scientific exchange at conferences, and contribute to both foundational research and its industrial applications within Fraunhofer's global network.

Qualifikationen

• Completed university degree (master's/diploma) in microelectronics, materials science, electrical engineering, physics, or comparable field.
• Three years of previous professional experience or completed doctorate.

Aufgaben

• Research and development in interconnect technologies.
• BEOL process integration of UPD solutions.
• Manage complex development projects across CNT groups.
• Evaluate and develop novel metallization solutions.
• Lead projects with feasibility and measurements in the 300mm cleanroom.
• Develop synergies between BEOL and advanced packaging.

Kenntnisse

BEOL metallization

CMP

PVD

Project management

Industrial collaboration

Semiconductor manufacturing

Reliability/precision

German language (B2)

English (C level)

Tools

PVD

CMP

UlSI processes

Jobbeschreibung

Research Associate: Interconnect Technologies (all genders)

The Fraunhofer-Gesellschaft ( www.fraunhofer.com ) is one of the world's leading organizations for application-oriented research. 74institutes develop pioneering technologies for our economy and society – more precisely: 30000 people from technology, science, administration and IT. They know: Anyone who comes to Fraunhofer wants to and can make a difference. For themselves, for us and for the markets of today and tomorrow.

Our »Center Nanoelectronic Technologies« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI (ultra-large-scale integration) level in the areas of front-end (FEoL) and back-end-of-line (BEoL) for various CMOS technology nodes.

The associated Interconnect Technologies group, which is part of our Neuropmorphic Computingbusiness unit, focuses on technologies for metallization in the BEOL (back end of line) of CMOS manufacturing and the border area to advanced packaging. The core theme of the group is the creation of copper lines through electrochemical deposition (ECD) and chemical mechanical polishing (CMP), as well as all wet chemical cleaning steps.

Be part of change

• Research and development in the field of interconnect technologies
• BEOL process integrationof existing UPD solutions to set up a complete BEOL metallization module
• Managing complex development projects in the field of metallization across different groups within the institute's division CNT
• Evaluation and potential development of novel metallization solutions
• Evaluation and responsibility for complex project ideas with regard to feasibility and the associated measures in the 300mm cleanroom
• Development of synergies between classic BEOL technologies andadvanced packaging, in particular silicon interposer technologies
• Project management and acquisitionfor industrially and publicly funded projects
• Scientific exchange and presentation of research results atconferencesand participation inworkshops

What you contribute

• Completeduniversity degree (master's/diploma)in microelectronics, materials science, electrical engineering, physics, or a comparable field
• Three years of previousprofessional experienceora completeddoctorate
• Know-how in the field of semiconductor manufacturing technologies,especially in BEOL or BE, preferably on HVM equipment platforms, e.g.:
• Thin film deposition (PVD)
• Chemical mechanical polishing (CMP)
• Advanced packaging
• BEOL process integration
• In-depth expertise in working with industrial partner companies
• Experience in project management;ideally with responsibility for acquiring publicly funded projects and direct industrial contracts
• Great knowledge of common analysis and measurement methods
• Independent and proactive approach to work with a focus on reliability and precision
• Pragmatic, flexible approach to work – especially in the event of unforeseen project changes
• Enthusiastic and friendly personalitywith a strong interest in working in a research environment
• Strong communication skills withgood German(B level) andvery good English(C level)

What we offer

• Attractive and international working environment in an innovative industry of the future
• Extensive and varied training and qualification opportunities
• Work-life balance thanks to flexible working hours and the option of mobile working
• Company pension scheme
• Job ticket for public transport
• 30 days vacation

An overview of all benefits and other good reasons to join us can be found here.

We offer female scientists the opportunity to participate in our TALENTA program: a comprehensive career and development program that includes individually tailored qualification offers. You can find out more here.

The weekly working time is 39 hours. This position is also available on a part-time basis. The position is initially limited to 2 years. Long-term employment is sought. We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities.Appointment, remuneration and social security benefits based on the public-sector collective wage agreement (TVöD). Additionally Fraunhofer may grant performance-based variable remuneration components.

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Contact

Mr. Dr. Conrad Guhl
Specialty Department
Telephone: [phone]

Fraunhofer Institute for Photonic Microsystems IPMS