Power Electronics Hardware Intern

Li Auto

München

Vor Ort

EUR 52.000 - 80.000

Vollzeit

14 Tage+
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Benefits dieser Stelle

Modern Munich office
Mentorship and collaboration with tech
Multicultural, entrepreneurial team

Zusammenfassung

Li Auto's Semiconductor Advanced Research team in Munich is seeking a hands-on engineer with strong expertise in power or MEMS semiconductor modules, packaging technologies, and electro-thermal-mechanical co-design. You will work in a cross-functional and international team to develop, validate, and continuously improve advanced semiconductor-module solutions.

You will contribute to designing and testing power semiconductor modules, creating 3D models and documentation, and collaborating with

Qualifikationen

  • Pursuing a Master’s/PhD in power electronics or related field.
  • Fundamental knowledge of power electronics and packaging.
  • Hands-on experience in electrical/mechanical design desirable.
  • Familiarity with PCB design tools is a plus.
  • Fluent English; German or Chinese a plus.

Aufgaben

  • Support design and development of power semiconductor modules and related mechanical/electrical components.
  • Create and update 3D component and assembly models, drawings, and documentation using CAD tools.
  • Define and document module-level bills of materials including substrates, copper, bonding wires, packaging materials, etc.
  • Collaborate with electrical, thermal, mechanical, and simulation engineers to evaluate and improve module designs.
  • Prepare, assemble, and support testing of power-electronics components and demonstrators.
  • Assist with electrical, thermal, and functional testing including data collection and reporting.
  • Support reliability-test and failure-analysis activities; document observations and follow-up actions.
  • Conduct technology scouting and benchmarking of power-semiconductor, packaging, and related tech.
  • Help build functional demonstrators and maintain clear technical documentation.

Kenntnisse

Power electronics
Semiconductor modules
Test automation
Data analysis
Python
MATLAB
Altium Designer
3D CAD
CATIA
SolidWorks

Ausbildung

Master's degree in power electronics or related field
PhD in power electronics or related field

Tools

Altium Designer
Cadence
CATIA
SolidWorks

Jobbeschreibung

Our Semiconductor Advanced Research team develops next-generation semiconductor, packaging, and application technologies for electric vehicle and embodied AI products. We combine system-level design, advanced packaging, simulation, testing, and failure analysis to transform early-stage concepts into validated demonstrators.

We are looking for a hands-on, self-driven engineer with strong expertise in power or MEMS semiconductor modules, packaging technologies, and electro-thermal-mechanical co-design. You will work in a cross-functional and international team to develop, validate, and continuously improve advanced semiconductor-module solutions.

Duties and responsibilities:
  • Support the design and development of power semiconductor modules and related mechanical or electrical components.
  • Create and update 3D component and assembly models, drawings, and technical documentation using CAD tools.
  • Support definition and documentation of module-level bills of materials, including substrates, copper materials, bonding wires, packaging materials, and other relevant components.
  • Work with electrical, thermal, mechanical, and simulation engineers to evaluate and improve module design concepts.
  • Prepare, assemble, and support testing of power-electronics components and semiconductor-module demonstrators.
  • Assist with electrical, thermal, and functional testing, including test setup preparation, data collection, analysis, and reporting.
  • Support reliability-test and failure-analysis activities; document observations and help track follow-up actions.
  • Conduct structured technology scouting and benchmarking of relevant power-semiconductor, packaging, and application technologies.
  • Support the team in building functional demonstrators and maintaining clear technical documentation.
Requirements:
Education/Experience
  • Currently pursuing a Master's degree or PhD in power electronics, microelectronics, electrical engineering, mechanical engineering, thermal engineering, materials science, or a related discipline.
  • Basic theoretical knowledge of power electronics, semiconductor devices, power modules, or electronic packaging.
  • Initial hands-on experience-through coursework, research, projects, or internships-in electrical, mechanical, or electronic-component design is desirable.
  • Interest in power-semiconductor-module testing, characterization, thermal management, and reliability.
  • Familiarity with PCB-design tools such as Altium Designer or Cadence is an advantage.
  • Familiarity with 3D CAD tools such as CATIA or SolidWorks is preferred.
  • Experience with laboratory equipment, test automation, data analysis, or programming tools such as Python or MATLAB is a plus.
  • A solution-oriented and hands-on mindset, with the willingness to learn quickly and turn technical questions into structured next steps.
  • Well organized, detail-oriented, and comfortable working in a fast-moving research and development environment.
  • Self-motivated, reliable, and proactive in identifying gaps, asking the right questions, and following tasks through to completion.
  • Professional fluency in spoken and written English; Chinese or German is a plus.
About Li Auto:

Li Auto is a leading Chinese new-energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles. Through product, technology, and business-model innovation, we create safer, more comfortable, and more convenient mobility experiences for families.

What we offer:
  • Practical experience in advanced power-semiconductor and packaging development.
  • Exposure to module design, simulation, prototype development, testing, and failure-analysis workflows.
  • Mentorship and collaboration with experts in power electronics, thermal engineering, mechanics, and semiconductor packaging.
  • A modern working environment in Munich and a multicultural, entrepreneurial team.
  • The opportunity to make a visible contribution to early-stage technology development for next-generation EV products.
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