Soft IP ASIC Engineer Intern - Verilog, FPGA Flows

QUALCOMM, Inc.; Ottawa; On-site; CAD 25,000 - 39,000; Full time

Job summary

QUALCOMM, Inc. in Ottawa, Ontario invites applications for 12- or 16-month internships in hardware and software verification environments.

Candidates will gain hands-on experience with Python, Verilog/VHDL, ASIC/FPGA flows, and debugging tools while collaborating in a multidisciplinary team. We seek students pursuing a bachelor’s degree in Electrical/Computer Engineering or Computer Science with strong problem-solving, communication, and attention to detail, available May/June 2027 through

Qualifications

• Pursuing a bachelor's degree in Electrical/Computer Engineering, Engineering Science, or Computer Science.
• Strong problem-solving and analytical skills with attention to detail.
• Excellent communication and teamwork abilities.
• Available for 12- or 16-month internship starting May/June 2027.

Responsibilities

• Assist with digital design and verification tasks on ASIC/FPGA projects.
• Work with Python, Verilog/VHDL, and debugging tools in a collaborative team.
• Support toolchains and flows across design and test activities.

Skills

Python

Perl

TCL

Unix/Linux shell scripting

SVN

CVS

RCS

Digital logic

Digital design

Verilog

VHDL

Debugging tools

ASIC/FPGA flows

Communication skills

Detail oriented

Analytical problem solving

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or related field

Tools

Verilog/VHDL tools

Debugging tool suites

Job description

QUALCOMM, Inc. in Ottawa, Ontario invites applications for 12- or 16-month internships in hardware and software verification environments.

Candidates will gain hands-on experience with Python, Verilog/VHDL, ASIC/FPGA flows, and debugging tools while collaborating in a multidisciplinary team. We seek students pursuing a bachelor’s degree in Electrical/Computer Engineering or Computer Science with strong problem-solving, communication, and attention to detail, available May/June 2027 through