Senior Design Engineer: Microelectronics & Advanced Packaging

SANMINA-SCI TECHNOLOGY INDIA PRIVATE LIMITED; Ottawa; On-site; CAD 154,000 - 223,000; Full time

Job summary

SANMINA-SCI TECHNOLOGY INDIA PRIVATE LIMITED is seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to lead the development of next-generation modules from concept through volume production. The role requires deep expertise in microelectronic packaging, thermal and mechanical analysis, and cross-functional collaboration with RF, Optical, and Reliability teams.

You will mentor junior staff, interface with customers and stakeholders, and contribute to technical proposals and

Qualifications

• Bachelor’s degree in Mechanical Engineering, Physics or related field.
• Minimum 12 years of relevant experience in electronic hardware design and semiconductor advanced packaging.
• Expert CAD skills in AutoCAD and SolidWorks; experience with FEA tools.
• Cadence Allegro Package Designer Plus experience required.

Responsibilities

• Lead microelectronic and advanced packaging solutions within a multidisciplinary team.
• Design and engineer microelectronic packages and modules with material selection and thermal/mechanical analysis.
• Evaluate industry trends to define design concepts aligned with customer requirements.
• Define specs for custom outsourced components and manage BOMs, drawings, ECOs.
• Provide mentorship to junior engineers on the team.
• Interface with customers, management and project stakeholders on updates and status.
• Assist business development with technical proposals and quotations.

Skills

AutoCAD

SolidWorks

Cadence Allegro

FEA tools

Education

Bachelor’s Degree in Mechanical Engineering, Physics, or related

Tools

Cadence Allegro Package Designer Plus

Job description

SANMINA-SCI TECHNOLOGY INDIA PRIVATE LIMITED is seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to lead the development of next-generation modules from concept through volume production. The role requires deep expertise in microelectronic packaging, thermal and mechanical analysis, and cross-functional collaboration with RF, Optical, and Reliability teams.

You will mentor junior staff, interface with customers and stakeholders, and contribute to technical proposals and